Resistance soldering device and method of using said device

A resistance soldering device configured for using with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed, said resistance soldering device comprising:

• an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors, wherein the bridge has a fixed end connected to the first electrical conductor and a free end configured to directly contact the first surface of the electrical terminal and wherein the second electrical conductor contacts the bridge at a location closer to the free end than the fixed end, wherein the bridge deflects the second electrical conductor, thereby providing a contact spring force between the bridge and the second electrical conductor, and wherein the second electrical conductor defines a V-shaped notch at a contact point between the second electrical conductor and the bridge.