H01R 43/0256
For soldering or welding connectors to a printed circuit board
Official title: {for soldering or welding connectors to a printed circuit board}
H01R43/0256 (For soldering or welding connectors to a printed circuit board) appears on 570 US grants and 512 published applications in this corpus.
Search patents in H01R- Granted patents
- 570
- Published applications
- 512
- Assignees
- 304
- Inventors
- 1,124
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 7 | 0 |
| 1997 | 10 | 0 |
| 1998 | 17 | 0 |
| 1999 | 11 | 0 |
| 2000 | 20 | 0 |
| 2001 | 31 | 9 |
| 2002 | 22 | 15 |
| 2003 | 15 | 28 |
| 2004 | 32 | 28 |
| 2005 | 24 | 24 |
| 2006 | 22 | 29 |
| 2007 | 23 | 20 |
| 2008 | 19 | 30 |
| 2009 | 21 | 25 |
| 2010 | 22 | 15 |
| 2011 | 13 | 15 |
| 2012 | 10 | 11 |
| 2013 | 8 | 18 |
| 2014 | 16 | 15 |
| 2015 | 13 | 11 |
| 2016 | 13 | 11 |
| 2017 | 16 | 22 |
| 2018 | 22 | 24 |
| 2019 | 22 | 31 |
| 2020 | 27 | 28 |
| 2021 | 15 | 13 |
| 2022 | 19 | 26 |
| 2023 | 15 | 22 |
| 2024 | 16 | 19 |
| 2025 | 12 | 10 |
| 2026 | 12 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and apparatus for surface mount connections8 Sep 2026US 12,731,922 B2Ciena Corporation
- Connector with housing having offset terminal protruding surface25 Aug 2026US 12,719,190 B2Sumitomo Wiring Systems, Ltd.
- Glass plate module21 Jul 2026US 12,689,139 B2Nippon Sheet Glass Co., Ltd.
- Connector element for a connector system for providing releasable electrical connection between components of a chain transmitting electrical signals21 Jul 2026US 12,689,144 B2Mettler-Toledo AG
- Circuit board, electronic device having the circuit board and method of manufacturing the electronic device7 Jul 2026US 12,677,372 B2Quan Mei Technology Co., Ltd.
- Cap and electrical connector with cap1 Oct 2026US 2026/0302706 A1Hirose Electric Co., Ltd.
- Electronic module and method of manufacturing electronic module24 Sep 2026US 2026/0291092 A1Shindengen Electric Manufacturing Co., Ltd.
- Method of attaching electrical connections to printed circuit boards10 Sep 2026US 2026/0269550 A1
- Shielded Connector Assembly With Frequency-Selective Slot Array20 Aug 2026US 2026/0246203 A1
- High density connector for superconducting applications20 Aug 2026US 2026/0246213 A1IQM Finland Oy
Most cited
By later US patents
- Apparatus and method for stacking integrated circuit devices147US 5,454,160 ANCR Corporation · 1995
- High density connector115US 6,024,584 ABerg Technology, Inc. · 2000
- Electrical contact for retaining solder preform102US 6,702,594 B2Hon Hai Precision Ind.Co., Ltd. · 2004
- Method of bonding connecting pins to the eyelets of conductors formed on a ceramic substrate101US 4,462,534 AInternational Business Machines Corporation · 1984
- Leadless high density connector92US 5,593,322 ADell USA, L. P. · 1997