Electronic module and method of manufacturing electronic module
AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorsSoichiro UMEDA, Atsushi KYUTOKU
Life of this patent
Estimating the term…
Abstract
An electronic module includes: an electronic element, a support member in which a through hole that penetrates the support member in a plate thickness direction is formed, and a pin terminal having a columnar shape, the pin terminal being supported on the support member in a state that the pin terminal is made to pass through the through hole and being electrically connected with the electronic element. The pin terminal includes: a pin body, and an electrically conductive peel-off material that is disposed on a surface of the pin body, and the pin terminal is supported by the support member in a state where the electrically conductive peel-off material is interposed at least at a portion between the through hole and the pin body.
Claims10
An electronic module comprising:
- an electronic element;
- a support member in which a through hole that penetrates the support member in a plate thickness direction is formed;
- and
- a pin terminal having a columnar shape, the pin terminal being supported on the support member in a state that the pin terminal is made to pass through the through hole and being electrically connected with the electronic element, wherein
- the pin terminal includes:
- a pin body;
- and an electrically conductive peel-off material that is disposed on a surface of the pin body, and the pin terminal is supported by the support member in a state where the electrically conductive peel-off material is interposed at least at a portion between the through hole and the pin body, the pin terminal.
A method of manufacturing an electronic module for manufacturing an electronic module that includes:
- an electronic element;
- a support member in which a through hole that penetrates the support member in a plate thickness direction is formed;
- and a pin terminal having a columnar shape, the pin terminal being supported on the support member in a state that the pin terminal is made to pass through the through hole and being electrically connected with the electronic element, the method of manufacturing an electronic module comprising:
- a pin terminal press fitting step of fitting the pin terminal having a pin body and an electrically conductive peel-off material that is disposed on a surface of the pin body into the through hole formed in the support member by press fitting, wherein
- in the pin terminal press fitting step, the pin terminal is fitted into the through hole formed in the support member while peeling off a portion of the electrically conductive peel-off material by a peripheral edge of the through hole.
Dependencies are inferred from the claim text.