H01R 43/0235
For applying solder
Official title: {for applying solder (H01R43/0228 takes precedence)}
H01R43/0235 (For applying solder) appears on 162 US grants and 140 published applications in this corpus.
Search patents in H01R- Granted patents
- 162
- Published applications
- 140
- Assignees
- 125
- Inventors
- 305
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 7 | 0 |
| 2001 | 5 | 2 |
| 2002 | 7 | 6 |
| 2003 | 4 | 8 |
| 2004 | 7 | 10 |
| 2005 | 9 | 12 |
| 2006 | 5 | 5 |
| 2007 | 5 | 1 |
| 2008 | 4 | 9 |
| 2009 | 3 | 3 |
| 2010 | 3 | 5 |
| 2011 | 4 | 1 |
| 2012 | 2 | 5 |
| 2013 | 3 | 4 |
| 2014 | 2 | 7 |
| 2015 | 5 | 14 |
| 2016 | 8 | 6 |
| 2017 | 11 | 5 |
| 2018 | 12 | 6 |
| 2019 | 6 | 4 |
| 2020 | 5 | 9 |
| 2021 | 6 | 8 |
| 2022 | 5 | 3 |
| 2023 | 3 | 0 |
| 2024 | 3 | 3 |
| 2025 | 1 | 1 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Techniques for soldering on a substrate with a below soldering temperature melting point24 Feb 2026US 12,562,541 B2Logitech Europe S. A.
- Method of using resistance soldering device21 Jan 2025US 12,206,215 B2Aptiv Technologies AG
- Electrically connecting device for superconducting wires20 Aug 2024US 12,068,567 B2Nexans
- Preformed solder-in-pin system9 Jul 2024US 12,034,263 B2Onanon, Inc.
- Resistance soldering device and method of using said device16 Apr 2024US 11,962,116 B2Aptiv Technologies AG
- Techniques for soldering on a substrate with a below soldering temperature melting point4 Jun 2026US 2026/0155614 A1Logitech Europe S. A.
- Tin-based solder paste, soldering method and electronic component using same19 Mar 2026US 2026/0081363 A1Cyntec Co., Ltd.
- Method of Attaching a Cable Connector12 Feb 2026US 2026/0045750 A1Welladsen Bros Pty Ltd
- Radio frequency connector and radio frequency connection device11 Dec 2025US 2025/0379409 A1Wistron Neweb Corp.
- Cable assembly14 Nov 2024US 2024/0379262 A1I-PEX Inc.
Most cited
By later US patents
- Solder mounting of electrical contacts132US 4,767,344 ABurndy Corporation · 1988
- Method and transfer plate for applying solder to component leads104US 4,722,470 AInternational Business Machines Corporation · 1988
- Terminal-carrying circuit board93US 5,656,798 AMatsushita Electric Works, Ltd. · 1997
- Leadless high density connector92US 5,593,322 ADell USA, L. P. · 1997
- System and method for an improved fine pitch joint72US 9,263,839 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016