H01R 13/2485
For contacting a ball
Official title: {for contacting a ball}
H01R13/2485 (For contacting a ball) appears on 112 US grants and 106 published applications in this corpus.
Search patents in H01R- Granted patents
- 112
- Published applications
- 106
- Assignees
- 73
- Inventors
- 217
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 4 |
| 2004 | 3 | 3 |
| 2005 | 5 | 8 |
| 2006 | 3 | 2 |
| 2007 | 4 | 4 |
| 2008 | 2 | 1 |
| 2009 | 1 | 4 |
| 2010 | 6 | 6 |
| 2011 | 2 | 4 |
| 2012 | 5 | 2 |
| 2013 | 2 | 4 |
| 2014 | 0 | 3 |
| 2015 | 6 | 5 |
| 2016 | 4 | 2 |
| 2017 | 5 | 5 |
| 2018 | 7 | 3 |
| 2019 | 4 | 6 |
| 2020 | 7 | 9 |
| 2021 | 9 | 8 |
| 2022 | 4 | 5 |
| 2023 | 2 | 3 |
| 2024 | 4 | 9 |
| 2025 | 5 | 3 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Shielded socket pin for device-to-device connection11 Aug 2026US 12,706,407 B2Intel Corporation
- High performance interposer and chip socket having contacts with an outer bean and an inner beam13 Jan 2026US 12,525,735 B2Amphenol Corporation
- Electrical connector with magnetic ball and planar spring retainer23 Dec 2025US 12,506,296 B2Cubios, Inc.
- Electrical connector2 Dec 2025US 12,489,230 B2Lotes Co., Ltd
- Standoff and support structures for reliable land grid array and hybrid land grid array interconnects7 Oct 2025US 12,439,542 B2International Business Machines Corporation
- Electrical connector apparatus and method1 Oct 2026US 2026/0302693 A1Samtec, Inc.
- Electronic assembly20 Aug 2026US 2026/0246182 A1Wistron Corporation
- Terminal, connector, and electronic device5 Jun 2025US 2025/0183575 A1Zte Corporation
- Socket contact pin depopulation and housing cut-out in low s-g region for post-resonance crosstalk suppression in high frequency applications27 Feb 2025US 2025/0070491 A1Intel Corporation
- Chip connector with improved terminals20 Feb 2025US 2025/0062561 A1Foxconn Interconnect Technology Limited
Most cited
By later US patents
- Methods of assembling microelectronic assembly with socket for engaging bump leads327US 5,802,699 ATessera, Inc. · 1998
- Soldering with resilient contacts217US 5,980,270 ATessera, Inc. · 1999
- Connector assembly for chip testing210US 4,975,079 AInternational Business Machines Corporation · 1990
- Soldering with resilient contacts176US 5,615,824 ATessera, Inc. · 1997
- Ball grid array socket assembly176US 5,702,255 AAdvanced Interconnections Corporation · 1997