Standoff and support structures for reliable land grid array and hybrid land grid array interconnects

A method for producing a land grid array (LGA) socket connector assembly, comprising:

• providing a carrier having an array of vias;
• providing contact features on a top surface of the carrier adjacent to corresponding vias, wherein the contact features are made by:
• applying an etch mask over contact feature regions in which the contact features are located;
• etching a copper layer of the carrier to remove portions of the copper layer except where the etch mask is located;
• and
• removing the etch mask, leaving copper support features adjacent to respective via holes;
• providing socket contact springs, each comprising:
• a hole support structure that supports the socket contact spring within a corresponding via of the array of vias;
• and
• a contact beam configured to contact a conductor of an integrated circuit to be placed within the socket connector assembly;
• wherein the contact features are configured to have a height that prevents the contact beams from inelastically deforming when bent under load.

An assembly, comprising:

• a land grid array (LGA) socket connector assembly, comprising:
• a laminate carrier housing having an array of vias;
• contact features on a top surface of the carrier housing adjacent to corresponding vias;
• socket contact springs, each comprising:
• a hole support structure that supports the socket contact spring within a corresponding via of the array of vias;
• and
• a contact beam configured to contact a conductor of an integrated circuit to be placed within the socket connector assembly;
• wherein the contact features are configured to have a height that prevents the contact beams from inelastically deforming when bent under load;
• wherein the carrier comprises a first hole adjacent to at least one via of the array of vias, wherein a first contact feature of the contact features adjacent to the at least one via extends downward from the top surface of the carrier into the first hole and extends above the top surface of the carrier to have the height.