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US 2025/0070491 A1Published application
Socket contact pin depopulation and housing cut-out in low s-g region for post-resonance crosstalk suppression in high frequency applications
AssigneeIntel Corporation
InventorsSaikat MONDAL, Zhichao ZHANG, Oluwafemi AKINWALE, Kemal AYGÜN
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Abstract
Embodiments disclosed herein include sockets and socket modules. In an embodiment, a socket module comprises a housing and a first pin through the housing in a first row of pins. In an embodiment, a second pin is through the housing in a second row of pins. In an embodiment, at least three intervening rows of pins are between the first row of pins and the second row of pins. In an embodiment, one or more pin locations in the at least three intervening rows of pins are depopulated.
Claims20
A socket module, comprising:
- a housing;
- a first pin through the housing in a first row of pins;
- a second pin through the housing in a second row of pins;
- and
- at least three intervening rows of pins between the first row of pins and the second row of pins, wherein one or more pin locations in the at least three intervening rows of pins are depopulated.
2 more elements
A socket module, comprising:
- a housing;
- an array of pins that pass through the housing, wherein the array of pins are arranged in a pattern;
- and
- a plurality of holes through the housing, wherein the holes are integrated into the pattern.
1 more element
An electronic system, comprising:
- a board;
- a package substrate coupled to the board by a socket module, wherein the socket module comprises:
- a housing;
- an array of pins through the housing;
- and
- one or more holes through the housing, wherein at least one hole is provided between a pair of pins;
- and
- a die coupled to the package substrate.
5 more elements
Dependencies are inferred from the claim text.