H01J 37/32541
Shape
Official title: {Shape}
H01J37/32541 (Shape) appears on 692 US grants and 925 published applications in this corpus.
Search patents in H01J- Granted patents
- 692
- Published applications
- 925
- Assignees
- 323
- Inventors
- 1,879
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 5 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 10 | 0 |
| 1999 | 9 | 0 |
| 2000 | 9 | 0 |
| 2001 | 7 | 4 |
| 2002 | 5 | 4 |
| 2003 | 5 | 8 |
| 2004 | 6 | 12 |
| 2005 | 1 | 18 |
| 2006 | 1 | 17 |
| 2007 | 1 | 15 |
| 2008 | 8 | 24 |
| 2009 | 9 | 48 |
| 2010 | 13 | 44 |
| 2011 | 17 | 46 |
| 2012 | 32 | 26 |
| 2013 | 29 | 31 |
| 2014 | 31 | 41 |
| 2015 | 26 | 52 |
| 2016 | 46 | 48 |
| 2017 | 28 | 44 |
| 2018 | 20 | 39 |
| 2019 | 38 | 44 |
| 2020 | 36 | 73 |
| 2021 | 48 | 43 |
| 2022 | 45 | 53 |
| 2023 | 51 | 63 |
| 2024 | 40 | 51 |
| 2025 | 43 | 38 |
| 2026 | 28 | 39 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Plasma processing apparatus6 Oct 2026US 12,755,939 B2Tokyo Electron Limited
- Surface modification method15 Sep 2026US 12,738,465 B2Sekisui Chemical Co., Ltd.
- Substrate support including multiple radio frequency (RF) electrodes8 Sep 2026US 12,731,766 B2Beijing Naura Microelectronics Equipment Co., Ltd.
- Plasma processing apparatus25 Aug 2026US 12,719,027 B2Tokyo Electron Limited
- Method for forming semiconductor device structure18 Aug 2026US 12,712,158 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of forming protective film on outer circumferential portion including bevel portion of substrate8 Oct 2026US 2026/0311973 A1Ebara Corporation
- Wafer placement table8 Oct 2026US 2026/0311975 A1NGK Corporation
- Plasma probe24 Sep 2026US 2026/0290759 A1Erbe Elektromedizin GmbH
- Microwave plasma generating apparatus, microwave plasma processing apparatus, and microwave plasma processing method27 Aug 2026US 2026/0253841 A1Abit Technologies Co., Ltd
- Substrate processing apparatus, plasma generating device, method of processing substrate, method of manufacturing semiconductor device and recording medium27 Aug 2026US 2026/0253847 A1Kokusai Electric Corporation
Most cited
By later US patents
- Plasma uniformity control by gas diffuser hole design746US 8,083,853 B2APPLIED Materials.Inc. · 2011
- Method of joining components for a composite showerhead electrode assembly for a plasma processing apparatus529US 8,484,846 B2Lam Research Corporation · 2013
- Clamped monolithic showerhead electrode488US 8,419,959 B2Lam Research Corporation · 2013
- Vapor-phase process apparatus, vapor-phase process method, and substrate474US 8,349,083 B2Sumitomo Electric Industries, Ltd. · 2013
- Method for reducing particle generation at bevel portion of substrate468US 9,343,343 B2ASM IP Holding B. V. · 2016