G05B 2219/45031
Manufacturing semiconductor wafers
G05B2219/45031 (Manufacturing semiconductor wafers) appears on 1,464 US grants and 1,800 published applications in this corpus.
Search patents in G05B- Granted patents
- 1,464
- Published applications
- 1,800
- Assignees
- 372
- Inventors
- 3,817
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 8 | 0 |
| 2000 | 10 | 0 |
| 2001 | 17 | 7 |
| 2002 | 28 | 40 |
| 2003 | 52 | 51 |
| 2004 | 56 | 63 |
| 2005 | 65 | 67 |
| 2006 | 57 | 71 |
| 2007 | 66 | 85 |
| 2008 | 42 | 80 |
| 2009 | 46 | 60 |
| 2010 | 60 | 51 |
| 2011 | 49 | 32 |
| 2012 | 34 | 35 |
| 2013 | 40 | 38 |
| 2014 | 32 | 43 |
| 2015 | 27 | 66 |
| 2016 | 44 | 66 |
| 2017 | 49 | 59 |
| 2018 | 53 | 55 |
| 2019 | 70 | 93 |
| 2020 | 71 | 80 |
| 2021 | 87 | 83 |
| 2022 | 54 | 116 |
| 2023 | 86 | 154 |
| 2024 | 96 | 105 |
| 2025 | 102 | 121 |
| 2026 | 60 | 79 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Part, sensor, and metrology data integration29 Sep 2026US 12,748,407 B2APPLIED Materials.Inc.
- System and method for semiconductor fabricating process22 Sep 2026US 12,743,069 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Information processing device and information processing method15 Sep 2026US 12,736,943 B2Ulvac, Inc.
- Radio frequency sensor calibration by virtual metrology1 Sep 2026US 12,724,395 B2Tokyo Electron Limited
- Radio frequency impedance matching network with flexible tuning algorithms1 Sep 2026US 12,724,401 B2APPLIED Materials.Inc.
- Water level sensor alarm8 Oct 2026US 2026/0310168 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Processing Apparatus, Substrate Processing Apparatus, Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium1 Oct 2026US 2026/0299561 A1Kokusai Electric Corporation
- Process tuning system for substrate processing systems1 Oct 2026US 2026/0299565 A1Lam Research Corporation
- Manufacturing execution control system, manufacturing execution control method, and manufacturing execution control program1 Oct 2026US 2026/0299566 A1SCREEN Holdings Co., Ltd.
- Neural processing unit configured for non-disruptive runtime testing1 Oct 2026US 2026/0301851 A1Deepx Co., Ltd.
Most cited
By later US patents
- Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot619US 6,074,443 AAPPLIED Materials.Inc. · 2000
- Method and system for using a buffer to track robotic movement553US 6,594,550 B1ASM America, Inc. · 2003
- Semiconductor manufacturing process monitoring544US 7,720,560 B2International Business Machines Corporation · 2010
- Device for controlling processing system, method for controlling processing system and computer-readable storage medium stored processing program542US 8,055,378 B2Tokyo Electron Limited · 2011
- Systems and methods for dynamic semiconductor process scheduling477US 9,659,799 B2ASM IP Holding B. V. · 2017