Radio frequency sensor calibration by virtual metrology
AssigneeTokyo Electron Limited
InventorsJun Shinagawa, Barton Lane, Merritt Funk, Shinichi Kozuka, Masashi Kanda
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AssigneeTokyo Electron Limited
InventorsJun Shinagawa, Barton Lane, Merritt Funk, Shinichi Kozuka, Masashi Kanda
Estimating the term…
A method of chamber matching is provided. A first virtual metrology (VM) model is configured to predict a first thickness change rate (TCR) for executing a plasma recipe in a first chamber. A second VM model is configured to predict a second TCR for executing the plasma recipe in a second chamber. The plasma recipe includes one or more inert gases and no reactive gases. A control model describes relationships between voltage, current and recipe parameters. In reference to a first voltage in the first chamber measured by a first radio frequency (RF) sensor, a second voltage in the second chamber measured by a second RF sensor is calibrated. In reference to a first current in the first chamber measured by the first RF sensor, a second current in the second chamber measured by the second RF sensor is calibrated.
A method of chamber matching, comprising:
An apparatus, comprising:
Dependencies are inferred from the claim text.