G03F 7/3007
Combined with electrical means
Official title: {combined with electrical means, e.g. force fields}
G03F7/3007 (Combined with electrical means) appears on 9 US grants and 11 published applications in this corpus.
Search patents in G03F- Granted patents
- 9
- Published applications
- 11
- Assignees
- 13
- Inventors
- 25
- Latest grant
- 6 Aug 2019
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 2 |
| 2017 | 1 | 1 |
| 2018 | 2 | 1 |
| 2019 | 1 | 1 |
| 2020 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- System for reducing ablation debris6 Aug 2019US 10,369,777 B2Agfa NV
- Treatment solution supply method, treatment solution supply apparatus, and non-transitory computer-readable recording medium17 Jul 2018US 10,023,477 B2Tokyo Electron Limited
- Resist sensitivity and profile improvement via acid anion control during field-guided post exposure bake12 Jun 2018US 9,996,006 B2APPLIED Materials.Inc.
- Anisotropic etching of metallic substrates10 Oct 2017US 9,783,909 B2Rolls-Royce North American Technologies Inc.
- Method and apparatus for development of lithographic printing plate precursor5 Oct 2010US 7,807,333 B2Eastman Kodak Company
- Radiation-sensitive composition and pattern-forming method12 Nov 2020US 2020/0356000 A9Jsr Corporation
- Radiation-sensitive composition and pattern-forming method21 Nov 2019US 2019/0354010 A1Jsr Corporation
- Resist sensitivity and profile improvement via acid anion control during field-guided post exposure bake19 Apr 2018US 2018/0107117 A1APPLIED Materials.Inc.
- A novel system for reducing ablation debris16 Nov 2017US 2017/0326869 A1Agfa Graphics NV
- Anisotropic etching of metallic substrates4 Aug 2016US 2016/0222518 A1Rolls-Royce North American Technologies Inc.
Most cited
By later US patents
- Enhancing photoresist performance using electric fields19US 7,374,867 B2Intel Corporation · 2008
- Parallel plate development with the application of a differential voltage6US 6,830,389 B2Advanced Micro Devices, Inc. · 2004
- Electrochemical developing process for reproduction layers5US 4,549,944 AHoechst Aktiengesellschaft · 1985
- Process for the continuous liquid processing of photosensitive compositions having reduced levels of residues4US 6,180,319 B2E. I. Du Pont de Nemours and Company · 2001