Resist sensitivity and profile improvement via acid anion control during field-guided post exposure bake
AssigneeApplied Materials, Inc.
InventorsChristine Y. Ouyang, Sang Ki Nam, Ludovic Godet
Life of this patent
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Abstract
Methods disclosed herein provide apparatus and methods for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes. In one embodiment, an apparatus includes a processing chamber configured to apply an electric field to a substrate via a non-gas phase intermediate medium. Methods described herein include dissociation of a photoacid generator to generate anions and cations. The anions may be moved within the photoresist layer by the electric field to more precisely control the speed and location of acid generation and regeneration processes.
Claims20
A substrate processing method comprising:
- positioning a substrate having a photoresist layer disposed thereon in an exposure chamber;
- exposing the substrate having a photoresist layer disposed thereon to electromagnetic radiation to form latent image lines on the substrate, wherein the photoresist layer includes a photoacid generator;
- dissociating the photoacid generator to form charged species within the photoresist layer;
- during the exposing a substrate to electromagnetic radiation, guiding the charged species in a direction perpendicular to a surface of the substrate;
- transferring the substrate from the exposure chamber to a post-exposure bake chamber;
- heating the substrate in the post-exposure bake chamber;
- and
- while heating the substrate in the post-exposure bake chamber, applying an electromagnetic field to the substrate via a non-gas phase medium to guide the charged species in a direction parallel to the latent image lines.
A substrate processing method comprising:
- positioning a substrate having a photoresist layer disposed thereon in an exposure chamber;
- exposing the substrate having a photoresist layer disposed thereon to electromagnetic radiation to form latent image lines on the substrate, wherein the photoresist layer includes a photoacid generator;
- dissociating the photoacid generator to form charged species within the photoresist layer;
- during the exposing a substrate to electromagnetic radiation, guiding the charged species in a direction parallel with the latent image lines;
- transferring the substrate from the exposure chamber to a post-exposure bake chamber;
- heating the substrate in the post-exposure bake chamber;
- and
- while heating the substrate in the post-exposure bake chamber, applying an electromagnetic field to the substrate via a non-gas phase medium to guide the charged species in a direction perpendicular to a surface of the substrate.
A substrate processing method comprising:
- positioning a substrate having a photoresist layer disposed thereon in an exposure chamber;
- exposing the substrate having a photoresist layer disposed thereon to electromagnetic radiation to form latent image lines on the substrate, wherein the photoresist layer includes a photoacid generator;
- dissociating the photoacid generator to form charged species within the photoresist layer;
- transferring the substrate from the exposure chamber to a post-exposure bake chamber;
- positioning the substrate between a first electrode assembly and a second electrode assembly;
- filling a volume between the first electrode assembly and the second electrode assembly with a non-gas phase medium;
- heating the substrate in the post-exposure bake chamber;
- while heating the substrate in the post-exposure bake chamber, applying a first electromagnetic field to the substrate to guide the charged species in a direction parallel to the latent image lies on the substrate;
- and
- applying a second electromagnetic field to the substrate to guide the charged species in a direction perpendicular to a surface of the substrate.
Dependencies are inferred from the claim text.