G03F 7/0025
Characterised by means for coating the developer
Official title: {characterised by means for coating the developer}
G03F7/0025 (Characterised by means for coating the developer) appears on 26 US grants and 23 published applications in this corpus.
Search patents in G03F- Granted patents
- 26
- Published applications
- 23
- Assignees
- 13
- Inventors
- 66
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 1 | 2 |
| 2020 | 1 | 2 |
| 2021 | 2 | 3 |
| 2022 | 1 | 0 |
| 2023 | 1 | 7 |
| 2024 | 4 | 5 |
| 2025 | 1 | 3 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Critical dimension inspection method and semiconductor device manufacturing method using the same22 Sep 2026US 12,743,026 B2Samsung Electronics Co., Ltd.
- Substrate treating method and substrate treating apparatus12 May 2026US 12,625,439 B2Semes Co., Ltd.
- Spin coater10 Feb 2026US 12,547,071 B2Samsung Electronics Co., Ltd.
- Developing apparatus and substrate processing apparatus7 Oct 2025US 12,436,457 B2
- Printer device, printing method, and program for outputting an exposure start signal without requiring a film detection device24 Dec 2024US 12,174,535 B2FUJIFILM Corporation
- Developing apparatus and substrate processing apparatus30 Oct 2025US 2025/0334876 A1STATS ChipPAC Pte. Ltd.
- Developing apparatus, developing method, and computer program9 Oct 2025US 2025/0314959 A1Tokyo Electron Limited
- Anti-slip compositions and components for semiconductor wafer handling systems24 Jul 2025US 2025/0237944 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Photoresist developer and method of developing photoresist7 Nov 2024US 2024/0371638 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Liquid treatment method and storage medium31 Oct 2024US 2024/0361687 A1Tokyo Electron Limited
Most cited
By later US patents
- Method for forming images using free flowing photosensitive microcapsules13US 4,865,943 AThe Mead Corporation · 1989
- Developer material coating apparatus4US 5,038,710 ABrother Kogyo Kabushiki Kaisha · 1991
- Image recording apparatus4US 5,060,011 ABrother Kogyo Kabushiki Kaisha · 1991
- Developer depositing unit for an image forming apparatus3US 5,083,151 ABrother Kogyo Kabushiki Kaisha · 1992
- Image recording apparatus provided with a selective power applying device3US 5,214,478 ABrother Kogyo Kabushiki Kaisha · 1993