Substrate treating method and substrate treating apparatus
AssigneeSemes Co., Ltd.
InventorHo Jin Jang
Life of this patent
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Abstract
The inventive concept provides a substrate treating method on which there is no generation of a portion on which a development is not performed, among a front surface of a substrate during a puddle process. The substrate treating method includes positioning a substrate in a treating space; forming a liquid film of a treating liquid on the substrate by supplying the treating liquid to a rotating substrate; and puddling including stopping the supplying of the treating liquid and reacting a thin film on the substrate with the liquid film on the substrate, and wherein an exhaust pressure provided at the treating space during the puddling is lower than an exhaust pressure provided at the treating space during the forming of the liquid film.
Claims15
A substrate treating method, comprising:
- positioning a substrate in a treating space;
- rotating the substrate;
- forming a liquid film of a treating liquid on the substrate by supplying the treating liquid onto the substrate during the rotating;
- puddling the substrate, the puddling including ceasing the supplying of the treating liquid and reacting a thin film of the substrate with the liquid film on the substrate;
- and
- applying a constant exhaust pressure to the treating space where a first exhaust pressure during the puddling is lower than a second exhaust pressure during the forming.
A substrate treating method, comprising:
- positioning a substrate in a treating space;
- rotating the substrate;
- forming a liquid film of a developing liquid on the substrate by supplying the developing liquid onto the substrate during the rotating;
- and
- puddling the substrate, the puddling including ceasing the supplying of the developing liquid and reacting a thin film of the substrate with the liquid film of the developing liquid;
- and
- applying a constant exhaust pressure to the treating space where a first exhaust pressure during the puddling is lower than a second exhaust pressure during the forming, and
- the forming and the puddling are repeated three times.
Dependencies are inferred from the claim text.