G03F 7/002
Photomechanical: using materials containing microcapsules
Official title: {using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor}
G03F7/002 (Photomechanical: using materials containing microcapsules) appears on 772 US grants and 189 published applications in this corpus.
Search patents in G03F- Granted patents
- 772
- Published applications
- 189
- Assignees
- 101
- Inventors
- 869
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 10 | 0 |
| 1986 | 10 | 0 |
| 1987 | 10 | 0 |
| 1988 | 35 | 0 |
| 1989 | 96 | 0 |
| 1990 | 138 | 0 |
| 1991 | 136 | 0 |
| 1992 | 71 | 0 |
| 1993 | 36 | 0 |
| 1994 | 21 | 0 |
| 1995 | 6 | 0 |
| 1996 | 7 | 0 |
| 1997 | 6 | 0 |
| 1998 | 2 | 0 |
| 1999 | 8 | 0 |
| 2000 | 13 | 0 |
| 2001 | 12 | 7 |
| 2002 | 15 | 16 |
| 2003 | 14 | 11 |
| 2004 | 12 | 5 |
| 2005 | 9 | 22 |
| 2006 | 6 | 9 |
| 2007 | 4 | 6 |
| 2008 | 4 | 5 |
| 2009 | 1 | 3 |
| 2010 | 2 | 4 |
| 2011 | 2 | 2 |
| 2012 | 0 | 3 |
| 2013 | 4 | 2 |
| 2014 | 1 | 6 |
| 2015 | 1 | 4 |
| 2016 | 5 | 14 |
| 2017 | 19 | 9 |
| 2018 | 8 | 5 |
| 2019 | 4 | 7 |
| 2020 | 5 | 12 |
| 2021 | 6 | 5 |
| 2022 | 7 | 1 |
| 2023 | 4 | 14 |
| 2024 | 4 | 8 |
| 2025 | 5 | 5 |
| 2026 | 5 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Critical dimension inspection method and semiconductor device manufacturing method using the same22 Sep 2026US 12,743,026 B2Samsung Electronics Co., Ltd.
- Substrate treating method and substrate treating apparatus12 May 2026US 12,625,439 B2Semes Co., Ltd.
- Crosstalk reduction of microcapsule imaging system7 Apr 2026US 12,596,302 B2Polaroid IP B. V.
- Photoresist bottle replacement system17 Mar 2026US 12,576,538 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Spin coater10 Feb 2026US 12,547,071 B2Samsung Electronics Co., Ltd.
- Photocurable composition for forming an imprint lithography template17 Sep 2026US 2026/0275018 A1Canon Kabushiki Kaisha
- Photoresist bottle replacement system25 Jun 2026US 2026/0175441 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Imaging media with dual layer developer structure25 Jun 2026US 2026/0177909 A1
- Photosensitive media with diluent/solvent microcapsules and photosensitive black microcapsules in under-layer25 Jun 2026US 2026/0177910 A1
- Developing apparatus and substrate processing apparatus30 Oct 2025US 2025/0334876 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Transfer imaging system356US 4,399,209 AThe Mead Corporation · 1983
- Photocopy sheet employing encapsulated radiation sensitive composition and imaging process205US 4,440,846 AThe Mead Corporation · 1984
- Dual roller apparatus for pressure fixing sheet material205US 5,195,430 ATektronix, Inc. · 1993
- Photohardenable compositions containing a dye borate complex and photosensitive materials employing the same155US 4,772,541 AThe Mead Corporation · 1988
- Photosensitive materials containing ionic dye compounds as initiators148US 4,772,530 AThe Mead Corporation · 1988