G02B 6/4231
With intermediate elements
Official title: {with intermediate elements, e.g. rods and balls, between the elements}
G02B6/4231 (With intermediate elements) appears on 368 US grants and 365 published applications in this corpus.
Search patents in G02B- Granted patents
- 368
- Published applications
- 365
- Assignees
- 198
- Inventors
- 809
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 8 | 0 |
| 1997 | 4 | 0 |
| 1998 | 14 | 0 |
| 1999 | 12 | 0 |
| 2000 | 6 | 0 |
| 2001 | 11 | 8 |
| 2002 | 15 | 32 |
| 2003 | 22 | 33 |
| 2004 | 21 | 16 |
| 2005 | 16 | 18 |
| 2006 | 12 | 7 |
| 2007 | 16 | 8 |
| 2008 | 11 | 4 |
| 2009 | 5 | 5 |
| 2010 | 3 | 6 |
| 2011 | 2 | 7 |
| 2012 | 4 | 10 |
| 2013 | 7 | 9 |
| 2014 | 10 | 19 |
| 2015 | 17 | 22 |
| 2016 | 21 | 24 |
| 2017 | 34 | 31 |
| 2018 | 15 | 13 |
| 2019 | 13 | 13 |
| 2020 | 13 | 7 |
| 2021 | 7 | 7 |
| 2022 | 7 | 8 |
| 2023 | 10 | 12 |
| 2024 | 9 | 12 |
| 2025 | 6 | 19 |
| 2026 | 3 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Optical engine assembly, optical interconnection system, and network device16 Jun 2026US 12,656,562 B2Huawei Technologies Co., Ltd.
- Optical isolators for multi-channel optical interconnects28 Apr 2026US 12,613,376 B2Intel Corporation
- Integrated photonics assemblies17 Feb 2026US 12,554,084 B2SiPhox, Inc.
- Opto-electronic integrated module17 Jun 2025US 12,332,489 B2Nippon Telegraph and Telephone Corporation
- Self-aligned structure and method on interposer-based PIC13 May 2025US 12,298,573 B1
- Devices and methods for manufacturing detachable co-packaged connectors17 Sep 2026US 2026/0276916 A1Mellanox Technologies, Ltd.
- Detachable cpo connector and associated methods17 Sep 2026US 2026/0276917 A1Mellanox Technologies, Ltd.
- Optical connector and receptacle for co-packaged optics10 Sep 2026US 2026/0267074 A1Corning Research & Development Corporation
- Methods and apparatus employing detachable fiberoptic connector with self-aligning features10 Sep 2026US 2026/0267094 A1Ciena Corporation
- Fiber array unit adapter with high-contrast fiducial structures27 Aug 2026US 2026/0251852 A1Corning Research & Development Corporation
Most cited
By later US patents
- Optoelectronic component with encapsulant486US 7,208,725 B2Rohm and Haas Electronic Materials LLC · 2007
- Optoelectronic component comprising an encapsulant486US 7,781,727 B2Nuvotronics, LLC · 2010
- Wafer-level optoelectronic device substrate484US 7,288,758 B2Rohm and Haas Electronic Materials LLC · 2007
- Optoelectronic component with flip-chip mounted optoelectronic device484US 8,049,161 B2Samsung Electronics Co., Ltd. · 2011
- Subassembly for optoelectronic devices161US 4,897,711 AAmerican Telephone and Telegraph Company · 1990