G02B 6/423
Using guiding surfaces for the alignment
Official title: {using guiding surfaces for the alignment}
G02B6/423 (Using guiding surfaces for the alignment) appears on 1,570 US grants and 1,603 published applications in this corpus.
Search patents in G02B- Granted patents
- 1,570
- Published applications
- 1,603
- Assignees
- 587
- Inventors
- 3,063
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 14 | 0 |
| 1989 | 10 | 0 |
| 1990 | 9 | 0 |
| 1991 | 5 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 16 | 0 |
| 1996 | 17 | 0 |
| 1997 | 19 | 0 |
| 1998 | 30 | 0 |
| 1999 | 32 | 0 |
| 2000 | 31 | 0 |
| 2001 | 48 | 28 |
| 2002 | 65 | 114 |
| 2003 | 64 | 88 |
| 2004 | 66 | 77 |
| 2005 | 57 | 76 |
| 2006 | 55 | 46 |
| 2007 | 65 | 46 |
| 2008 | 46 | 29 |
| 2009 | 31 | 39 |
| 2010 | 30 | 34 |
| 2011 | 22 | 38 |
| 2012 | 20 | 29 |
| 2013 | 29 | 64 |
| 2014 | 44 | 90 |
| 2015 | 78 | 80 |
| 2016 | 85 | 80 |
| 2017 | 93 | 82 |
| 2018 | 76 | 71 |
| 2019 | 57 | 68 |
| 2020 | 65 | 51 |
| 2021 | 40 | 59 |
| 2022 | 49 | 49 |
| 2023 | 41 | 70 |
| 2024 | 55 | 63 |
| 2025 | 44 | 85 |
| 2026 | 25 | 47 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Three-dimensional micro-optical systems6 Oct 2026US 12,754,381 B2X-Celeprint Limited
- Fiber connector bulkhead adapter with shroud for protecting high-power fiber6 Oct 2026US 12,754,385 B2nLIGHT, Inc.
- Fiber alignment system22 Sep 2026US 12,742,938 B2Corning Incorporated
- Molded optical connectors with zero-draft mechanical alignment features22 Sep 2026US 12,742,939 B23M Innovative Properties Company
- 400G silicon photonic package with self-aligned fiber22 Sep 2026US 12,742,940 B2SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited
- Mechanical Socket and Detachable Connectors for Co-Packaged Optics1 Oct 2026US 2026/0299225 A1Teramount Ltd.
- Next generation fiber optic module1 Oct 2026US 2026/0299228 A1
- Photonic integrated circuit connector with temperature-independent mechanical alignment24 Sep 2026US 2026/0287836 A13M Innovative Properties Company
- Optoelectronic semiconductor unit as well as components and a production method thereof17 Sep 2026US 2026/0276914 A1ams-OSRAM International GmbH
- Pluggable chip interposer for photonic chip alignment17 Sep 2026US 2026/0276915 A1University of Rochester
Most cited
By later US patents
- Optoelectronic component with encapsulant486US 7,208,725 B2Rohm and Haas Electronic Materials LLC · 2007
- Optoelectronic component comprising an encapsulant486US 7,781,727 B2Nuvotronics, LLC · 2010
- Wafer-level optoelectronic device substrate484US 7,288,758 B2Rohm and Haas Electronic Materials LLC · 2007
- Optoelectronic component with flip-chip mounted optoelectronic device484US 8,049,161 B2Samsung Electronics Co., Ltd. · 2011
- High frequency emmitter and detector packaging scheme for 10GB/S transceiver224US 7,008,120 B2Intel Corporation · 2006