Pluggable chip interposer for photonic chip alignment
AssigneeUniversity of Rochester
InventorsJaime Cardenas Gonzalez, Sushant Kumar
Life of this patent
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Abstract
A system for aligning chips, such as chips with photonic devices, includes a first device, such as a laser, on a first chip, a second device, such as a mode converter, on a second chip, and a substrate. A first pattern is formed in the first chip, and a second pattern is formed in the second chip. A third pattern is formed in the substrate and arranged to complement the first pattern and the second pattern so that the first device is aligned (e.g., optically) with the second device while the first chip and the second chip are mounted on the substrate.
Claims27
(canceled)
A system for aligning photonic devices comprising:
- a first chip comprising a first substrate coupled with a first optical device, a first pattern formed within the first substrate, wherein the first pattern is a three-dimensional pattern;
- a second chip comprising a second substrate coupled with a second optical device, a second pattern formed within the second substrate, wherein the second pattern is a three-dimensional pattern;
- and
- a third substrate, a third pattern formed within the third substrate, wherein the third pattern is a three-dimensional pattern and arranged to complement the first pattern and the second pattern so that the first optical device is optically aligned with the second optical device while the first chip and the second chip are mounted on the third substrate.
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A method for aligning photonic devices comprising:
- obtaining a first chip, wherein the first chip comprises a first substrate coupled with a first optical device, a first pattern formed within the first substrate, wherein the first pattern is a three-dimensional pattern;
- obtaining a second chip, wherein the second chip comprises a second substrate coupled with a second optical device, a second pattern formed within the second substrate, wherein the second pattern is a three-dimensional pattern;
- obtaining a third substrate, a third pattern formed within the third substrate, wherein the third pattern is a three-dimensional pattern;
- and
- mounting the first chip and the second chip on the third substrate, wherein the third pattern is arranged to complement the first pattern and the second pattern so that the first optical device is optically aligned with the second optical device while the first chip and the second chip are mounted on the third substrate.
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A system comprising:
- a first chip comprising a first device, a first pattern formed within the first chip;
- a second chip comprising a second device, a second pattern formed within the second chip;
- and
- a substrate, a third pattern formed within the substrate, wherein:
- the third pattern is arranged to complement the first pattern and/or the second pattern;
- and
- the first device is aligned with the second device.
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Dependencies are inferred from the claim text.