Devices and methods for manufacturing detachable co-packaged connectors
AssigneeMellanox Technologies, Ltd.
InventorsVictor BIGIO, Idan CHAYUN, Samer YASIN
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AssigneeMellanox Technologies, Ltd.
InventorsVictor BIGIO, Idan CHAYUN, Samer YASIN
Estimating the term…
Some embodiments of the present disclosure are directed to a method for manufacturing detachable electronic modules. The method may include providing a fine alignment element, receiving the fine alignment element in a cavity of a positioning tool, aligning the positioning tool with a planar body of a mounting element or a coupling surface of an attachment element while maintaining the fine alignment element in the cavity of the positioning tool, disposing the fine alignment element in a concavity of the mounting element or the attachment element using the positioning tool, and maintaining the fine alignment element in the concavity using the positioning tool while bonding the fine alignment element within the concavity. Some embodiments of the present disclosure are directed to a positioning tool, which may include a base member defining a plurality of cavities, where each cavity includes a vacuum port in communication with a vacuum source.
A. positioning tool comprising:
A. method comprising:
A. method comprising:
Dependencies are inferred from the claim text.