Subassembly for optoelectronic devices

A subassembly for an optoelectronic device comprising

• a semiconductor base having a major surface,
• an insulative layer on said surface,
• metal contacts disposed on said layer, said device being located on said surface and connected to said contacts, and
• a semiconductor lid having a cavity, said lid being disposed over said base so that said device is positioned in said cavity, at least one dimension of said lid parallel to said surface being less than the corresponding dimension of said base, so that segments of said contacts extend from under said lid to the exterior of said subassembly, and
• said subassembly having channel means for receiving an optical fiber for carrying light between said device and the exterior of said subassembly.

A subassembly for an optoelectronic device comprising

• a single crystal silicon base having a (100) major surface and first and second grooves arranged in tandem in said surface, said first groove being narrower than said second groove, said second groove extending to the exterior of said subassembly and capable of receiving a larger diameter portion of an optical fiber and said first groove capable of receiving a narrower diameter portion of said fiber, said first and second grooves having side walls and an end face formed by crystallographic planes which are oblique to said surface,
• a silicon oxide insulative layer formed on at least a portion of said surface,
• metal contacts disposed on said layer, at least one of said contacts overlapping said end face and forming a reflector,
• said device being disposed over said reflector and connected to said contacts, so that said reflector directs light between said device and said fiber,
• a single-crystal silicon lid disposed on said base, said lid having a (100) major surface and a cavity therein for receiving said device, and further having a third groove therein aligned with said first groove, thereby forming an elongated channel for receiving said fiber,
• said lid using a first opening in communication with said cavity and a conformal coating, inserted through said opening, covering said device, and having a second opening in communication with said elongated channel and an adhesive, inserted through said opening, securing said fiber to said subassembly,
• exterior major surfaces of said base and lid being metalized,
• at least one dimension of said lid parallel to said surface being less than the corresponding dimension of said base, so that segments of said contacts extend from under said lid to the exterior of said subassembly, and
• means for aligning said lid and base to one another comprising at least one hole formed by crystallographic planes in each of said base and lid, said holes being positioned so that when they are aligned, then the base and lid are also aligned, and a sphere positioned in one of the holes so as to guide said holes into alignment.

A subassembly for an optoelectronic device comprising

• a base on which said device is mounted,
• a semiconductor lid positioned over said base, said lid having a groove therein for receiving an optical fiber and a reflector formed on an endface of said groove to direct light between said fiber and said device,
• a semiconductor carrier having an aperture extending therethrough,
• said carrier being positioned between said base and said lid, and
• a lens mounted in said aperture so as to focus light between said reflector and said device.