US 12,332,489 B2Granted

Opto-electronic integrated module

AssigneeNippon Telegraph and Telephone Corporation

InventorsYuriko Kawamura, Kiyofumi Kikuchi, Ken Tsuzuki

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Abstract

In an integrated optoelectronic module according to the present disclosure, a heat dissipation path for an electric integrated circuit (IC) for signal processing, which consumes a relatively large amount of power, and a heat dissipation path for an electric IC for driving an optical circuit are separated from each other. The electric IC for driving an optical circuit is mounted on a connection surface of a photonic IC in the state in which a connection surface of the electric IC for driving an optical circuit faces the connection surface of the photonic IC. The electric IC for driving an optical circuit is housed in a depressed portion formed at a portion in a substrate on a connection surface side coupled to a photonic IC. The bottom portion of the depressed portion is thermally coupled to a non-connection surface of the electric IC for driving an optical circuit.

Claims8

Dependent claims

An integrated optoelectronic module comprising:

a substrate;
a photonic integrated circuit (IC) mounted on the substrate with a plurality of connections interposed between the photonic IC and the substrate;
a first electric IC mounted to face a connection surface of the photonic IC, the first electric IC being electrically coupled to the photonic IC with a plurality of connections interposed between the first electric IC and the photonic IC;
and
a second electric IC mounted on the substrate with a plurality of connections interposed between the second electric IC and the substrate, wherein
the first electric IC is housed in a depressed portion formed in the substrate inside a region corresponding to the photonic IC when a substrate surface is viewed, and a bottom surface of the depressed portion is connected to an opposite surface of the first electric IC with a filler interposed between the depressed portion and the first electric IC, the opposite surface being opposite to a connection surface of the first electric IC.

3 more elements

Dependencies are inferred from the claim text.