G01P 15/0802
Details
Official title: {Details}
G01P15/0802 (Details) appears on 1,879 US grants and 1,559 published applications in this corpus.
Search patents in G01P- Granted patents
- 1,879
- Published applications
- 1,559
- Assignees
- 569
- Inventors
- 2,873
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 11 | 0 |
| 1988 | 6 | 0 |
| 1989 | 12 | 0 |
| 1990 | 23 | 0 |
| 1991 | 15 | 0 |
| 1992 | 21 | 0 |
| 1993 | 25 | 0 |
| 1994 | 30 | 0 |
| 1995 | 37 | 0 |
| 1996 | 46 | 0 |
| 1997 | 60 | 0 |
| 1998 | 57 | 0 |
| 1999 | 54 | 0 |
| 2000 | 68 | 0 |
| 2001 | 75 | 18 |
| 2002 | 43 | 36 |
| 2003 | 35 | 42 |
| 2004 | 45 | 57 |
| 2005 | 47 | 70 |
| 2006 | 49 | 63 |
| 2007 | 49 | 67 |
| 2008 | 46 | 59 |
| 2009 | 32 | 67 |
| 2010 | 50 | 92 |
| 2011 | 46 | 76 |
| 2012 | 83 | 59 |
| 2013 | 69 | 74 |
| 2014 | 63 | 60 |
| 2015 | 52 | 69 |
| 2016 | 59 | 58 |
| 2017 | 63 | 72 |
| 2018 | 55 | 83 |
| 2019 | 53 | 91 |
| 2020 | 92 | 81 |
| 2021 | 75 | 53 |
| 2022 | 60 | 54 |
| 2023 | 54 | 63 |
| 2024 | 52 | 52 |
| 2025 | 30 | 24 |
| 2026 | 21 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same22 Sep 2026US 12,741,863 B2Vanguard International Semiconductor Corporation
- Inertial measurement device22 Sep 2026US 12,742,662 B2Seiko Epson Corporation
- Optical displacement sensors8 Sep 2026US 12,730,124 B2Sensibel AS
- Door fault identification28 Jul 2026US 12,693,272 B2Schlage Lock Company LLC
- Inertial sensor, method of manufacturing inertial sensor, and inertial measurement unit28 Jul 2026US 12,693,307 B2Seiko Epson Corporation
- Resonance reducing asymmetric damper for vibration sensor assembly1 Oct 2026US 2026/0298697 A1Blue Oak Co., Ltd.
- Accelerometer with proof mass bonding feature10 Sep 2026US 2026/0266866 A1Honeywell International Inc.
- Microelectromechanical system20 Aug 2026US 2026/0242214 A1Murata Manufacturing Co., Ltd.
- Microelectromechanical system20 Aug 2026US 2026/0243799 A1Murata Manufacturing Co., Ltd.
- Composite sensor and method of manufacturing composite sensor6 Aug 2026US 2026/0227423 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Method of forming a semiconductor structure having an air region510US 5,324,683 AMotorola, Inc. · 1994
- Laterally driven resonant microstructures419US 5,025,346 AThe Regents of the University of California · 1991
- Semiconductor device including eutectic bonding portion and method for manufacturing the same314US 6,555,901 B1Denso Corporation · 2003
- Method of fabrication of a microstructure having an internal cavity302US 6,297,072 B1Interuniversitair Micro-Elktronica Centrum (IMEC VZW) · 2001
- Etchants for use in micromachining of CMOS Microaccelerometers and microelectromechanical devices and method of making the same285US 5,726,480 AThe Regents of the University of California · 1998