G01L 9/0045
Diaphragm associated with a buried cavity
Official title: {Diaphragm associated with a buried cavity}
G01L9/0045 (Diaphragm associated with a buried cavity) appears on 123 US grants and 141 published applications in this corpus.
Search patents in G01L- Granted patents
- 123
- Published applications
- 141
- Assignees
- 69
- Inventors
- 276
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 2 |
| 2005 | 1 | 2 |
| 2006 | 2 | 5 |
| 2007 | 0 | 1 |
| 2008 | 1 | 5 |
| 2009 | 5 | 0 |
| 2010 | 1 | 1 |
| 2011 | 4 | 2 |
| 2012 | 2 | 6 |
| 2013 | 5 | 11 |
| 2014 | 8 | 5 |
| 2015 | 9 | 11 |
| 2016 | 4 | 12 |
| 2017 | 16 | 12 |
| 2018 | 6 | 10 |
| 2019 | 10 | 11 |
| 2020 | 11 | 13 |
| 2021 | 12 | 3 |
| 2022 | 5 | 4 |
| 2023 | 6 | 8 |
| 2024 | 4 | 6 |
| 2025 | 3 | 5 |
| 2026 | 4 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and method for sensing external condition in harsh environment15 Sep 2026US 12,736,425 B2UTAC Headquarters Pte. Ltd.
- Device for performing ultrasonic examinations and pressure measurements12 May 2026US 12,622,676 B2Compremium AG
- Micro-electro-mechanical device for transducing high-frequency acoustic waves in a propagation medium and manufacturing process thereof17 Feb 2026US 12,552,660 B2STMicroelectronics S,r.l.
- MEMS device comprising an insulated suspended diaphragm, in particular pressure sensor, and manufacturing process thereof6 Jan 2026US 12,515,942 B2STMicroelectronics S,r.l.
- Sensor die with a diaphragm7 Oct 2025US 12,436,049 B2
- Stress-decoupled micromechanical pressure sensor and method for the production thereof10 Sep 2026US 2026/0266678 A1
- Micromechanical component for a sensor device, microphone device and/or micro-loudspeaker device27 Aug 2026US 2026/0250121 A1
- High temperature co-fired ceramic pressure sensor23 Jul 2026US 2026/0210784 A1
- Capacitive microelectromechanical pressure transducer and related manufacturing process28 May 2026US 2026/0145928 A1STMicroelectronics International N. V.
- Pressure sensor having high detection performance and optimized manufacturing30 Apr 2026US 2026/0118197 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Method of making a semiconductive structure useful as a pressure sensor72US 4,993,143 ADelco Electronics Corporation · 1991
- Episeal pressure sensor and method for making an episeal pressure sensor68US 6,928,879 B2Robert Bosch GmbH · 2005
- MEMS capacitive pressure sensor65US 9,772,245 B2ams International AG · 2017
- Analog data-input device provided with a pressure sensor of a microelectromechanical type32US 8,044,929 B2STMicroelectronics S,r.l. · 2011
- Method for manufacturing a semiconductor pressure sensor30US 8,173,513 B2STMicroelectronics S,r.l. · 2012