G01L 19/148
Details about the circuit board integration
Official title: {Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation}
G01L19/148 (Details about the circuit board integration) appears on 386 US grants and 340 published applications in this corpus.
Search patents in G01L- Granted patents
- 386
- Published applications
- 340
- Assignees
- 211
- Inventors
- 961
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 6 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 8 | 0 |
| 1990 | 5 | 0 |
| 1991 | 2 | 0 |
| 1992 | 6 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 7 | 0 |
| 2001 | 4 | 2 |
| 2002 | 7 | 10 |
| 2003 | 14 | 6 |
| 2004 | 9 | 6 |
| 2005 | 10 | 22 |
| 2006 | 13 | 15 |
| 2007 | 17 | 6 |
| 2008 | 9 | 8 |
| 2009 | 7 | 15 |
| 2010 | 10 | 9 |
| 2011 | 7 | 12 |
| 2012 | 14 | 13 |
| 2013 | 11 | 18 |
| 2014 | 14 | 17 |
| 2015 | 10 | 17 |
| 2016 | 7 | 8 |
| 2017 | 16 | 19 |
| 2018 | 15 | 19 |
| 2019 | 16 | 21 |
| 2020 | 15 | 22 |
| 2021 | 23 | 11 |
| 2022 | 17 | 13 |
| 2023 | 11 | 11 |
| 2024 | 12 | 13 |
| 2025 | 13 | 14 |
| 2026 | 5 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sensor module having an intermediate pedestal on which one or more die are mounted16 Jun 2026US 12,656,202 B2Apple Inc.
- Pressure sensor with flat flange and central elevated portion2 Jun 2026US 12,644,789 B2STMicroelectronics International N. V.
- Pressure transducer package having a rigid transfer block for assembly tolerance19 May 2026US 12,630,417 B2Infineon Technologies AG
- Sensor member for physical quantity detection19 May 2026US 12,631,504 B2TDK Corporation
- Split-type piezoelectric sensor21 Apr 2026US 12,607,531 B2Keeson Technology Corporation Limited
- Pressure sensor device, pressure sensor system, and method for manufacturing of the pressure sensor device8 Oct 2026US 2026/0309564 A1NXP USA, Inc.
- Pressure sensor and process for manufacturing same1 Oct 2026US 2026/0298746 A1Sc2N
- Pressure sensing apparatus6 Aug 2026US 2026/0227257 A1Honeywell International Inc.
- Connection device for measuring physical quantities of a fluid16 Jul 2026US 2026/0202276 A1
- Sensor assembly9 Jul 2026US 2026/0194406 A1TE Connectivity Sensors France
Most cited
By later US patents
- Sensor mounted in flip-chip technology on a substrate274US 8,791,532 B2Sensirion AG · 2014
- Method for packaging microsensors228US 6,140,144 AIntegrated Sensing Systems, Inc. · 2000
- Pressure telemetry implant209US 4,519,401 ACase Western Reserve University · 1985
- Catheter assembly129US 4,815,471 APrecision Interconnect Corporation · 1989
- Force sensor assembly with integrated rigid, movable interface for transferring force to a responsive medium116US 5,661,245 ASensym, Incorporated · 1997