Pressure sensor device, pressure sensor system, and method for manufacturing of the pressure sensor device

A sensor system, comprising:

• a sensor device, a system substrate, and a circuit,
• a sensor substrate,
• a sensor capacitor,
• wherein the sensor device comprising a first sensor contact element, and a second sensor contact element,
• wherein the sensor capacitor is arranged on a surface, referred to as the first top surface, of the sensor substrate,
• wherein the sensor capacitor comprises a first sensor electrode and a second sensor electrode,
• wherein the second sensor electrode is arranged between the first sensor electrode and the first top surface of the sensor substrate such that a sensor cavity is provided between the first and second sensor electrodes,
• wherein both of the first and second sensor contact elements are arranged on another surface, referred to as the first bottom surface, of the sensor substrate,
• wherein a first electrical interconnection extends through the sensor substrate from the first sensor electrode to the first sensor contact element,
• wherein a second electrical interconnection extends through the sensor substrate from the second sensor electrode to the second sensor contact element,
• wherein the circuit is arranged on a surface, referred to as a second top surface, of the system substrate,
• wherein the circuit comprises a first circuit contact element and a second circuit contact element, and
• wherein the first sensor contact element is electrically coupled to the first circuit contact element and the second sensor contact element is electrically coupled to the second circuit contact element such that the first bottom surface of the sensor substrate is arranged opposite the circuit and/or the system substrate.

A method of manufacturing a sensor device, the method comprising the steps of:

• a) removing substrate material of a sensor substrate to create a first channel and a second channel each extending from a sensor substrate surface, referred to as first top surface, toward another sensor substrate surface, referred to as first bottom surface,
• b) forming a first isolation layer on an inner surface of the first channel, forming a second isolation layer on an inner surface of the second channel, and forming a third isolation layer on the first top surface of the sensor substrate,
• c) forming a first electrical interconnection that extends through the third isolation layer and along the first channel, and forming a second electrical interconnection that extends through the third isolation layer and along the second channel,
• d) forming or depositing a sensor capacitor on the third isolation layer such that a first sensor electrode of the sensor capacitor is electrically connected only to the first electrical interconnection and a second sensor electrode of the sensor capacitor is electrically connected only to the second electrical interconnection, the second sensor electrode being arranged between the first sensor electrode and the third isolation layer, such that a sensor cavity is provided between the first sensor electrode and the second sensor electrode, and
• e) forming a first sensor contact element on the first bottom surface of the sensor substrate such that the first sensor contact element is electrically connected to the first electrical interconnection, and forming a second sensor contact element on the first bottom surface of the sensor substrate such that the second sensor contact element is electrically connected to the second electrical interconnection.