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US 12,644,789 B2Granted
Pressure sensor with flat flange and central elevated portion
AssigneeSTMicroelectronics International N.V.
InventorsLuca Maggi, Marco Del Sarto, Alex Gritti
Life of this patent
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Abstract
A sensor module includes an organic substrate, a MEMS pressure sensor mounted to the organic substrate, and a unitary lid mounted on the substrate. The unitary lid includes a central elevated portion housing the MEMS pressure sensor, an aperture in the central elevated portion, and a flat flange extending from the central elevated portion to an edge of the organic substrate.
Claims19
A sensor module, comprising:
- an organic substrate;
- a MEMS pressure sensor mounted to the substrate;
- a unitary lid mounted on the substrate and including:
- a central elevated portion housing the MEMS pressure sensor;
- an aperture in the central elevated portion;
- and
- a flat flange extending from the central elevated portion toward an edge of the organic substrate, wherein a width of the flat flange from a first edge of the flat flange to an opposite edge of flat flange is at least five times as large as a height of the central elevated portion.
4 more elements
A method, comprising:
- mounting a MEMS pressure sensor on a substrate;
- mounting a unitary lid on the substrate, the unitary lid including:
- a central elevated portion housing the MEMS pressure sensor;
- an aperture in the central elevated portion;
- and
- a flat flange extending from the central elevated portion to an edge of the substrate, wherein a width of the flat flange from a first edge of the flat flange to an opposite edge of flat flange is at least five times as large as a height of the central elevated portion;
- partially filling the central elevated portion with a sealing gel;
- performing a first curing process of the sealing gel;
- filling a remainder of the central elevated portion with the sealing gel after performing the first curing process;
- and
- performing a second curing process of the sealing gel.
8 more elements
A method, comprising:
- generating, with a MEMS pressure sensor coupled to a substrate, analog pressure signals;
- receiving, with an ASIC electrically coupled to the MEMS pressure sensor, digital pressure signals based on the analog pressure signals;
- passing the digital pressure signals to a control circuit of an electronic device, wherein the MEMS pressure sensor and the ASIC are positioned within a central elevated portion of a unitary lid mounted on the substrate and including an aperture in the central elevated portion and a flat flange extending from the central elevated portion to an edge of the substrate, wherein a width of the flat flange from a first edge of the flat flange to an opposite edge of flat flange is at least five times as large as a height of the central elevated portion.
Dependencies are inferred from the claim text.