C30B 31/14
Substrate holders or susceptors
C30B31/14 (Substrate holders or susceptors) appears on 156 US grants and 57 published applications in this corpus.
Search patents in C30B- Granted patents
- 156
- Published applications
- 57
- Assignees
- 83
- Inventors
- 311
- Latest grant
- 3 Dec 2019
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 8 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 9 | 0 |
| 1997 | 8 | 0 |
| 1998 | 13 | 0 |
| 1999 | 6 | 0 |
| 2000 | 7 | 0 |
| 2001 | 6 | 5 |
| 2002 | 12 | 8 |
| 2003 | 9 | 6 |
| 2004 | 7 | 4 |
| 2005 | 1 | 4 |
| 2006 | 1 | 10 |
| 2007 | 6 | 3 |
| 2008 | 3 | 5 |
| 2009 | 4 | 0 |
| 2010 | 6 | 2 |
| 2011 | 1 | 1 |
| 2012 | 1 | 1 |
| 2013 | 2 | 1 |
| 2014 | 1 | 1 |
| 2015 | 1 | 1 |
| 2016 | 0 | 1 |
| 2017 | 0 | 1 |
| 2018 | 0 | 1 |
| 2019 | 2 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for producing SiC epitaxial wafer and method for producing SiC epitaxial wafer3 Dec 2019US 10,494,737 B2Showa Denko K. K.
- Substrate treating apparatus19 Feb 2019US 10,208,401 B2Samsung Electronics Co., Ltd.
- Rapid conductive cooling using a secondary process plane8 Dec 2015US 9,209,049 B2APPLIED Materials.Inc.
- Rapid conductive cooling using a secondary process plane25 Feb 2014US 8,658,947 B2APPLIED Materials.Inc.
- Method and jig for holding silicon wafer16 Apr 2013US 8,419,001 B2Sumco Corporation
- Doped polycrystalline sic wafer with improved flatness and electrical conductivity, and method for producing such a wafer20 Aug 2026US 2026/0242976 A1Mersen France Gennevilliers SAS
- Wafer boat structure, as well as wafer boat assembly and diffusion furnace with same12 May 2022US 2022/0148899 A1
- Substrate treating apparatus20 Sep 2018US 2018/0266017 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus and substrate processing method14 Sep 2017US 2017/0260630 A1Sumitomo Chemical Company, Limited
- Apparatus for producing sic epitaxial wafer and method for producing sic epitaxial wafer27 Oct 2016US 2016/0312381 A1Showa Denko K. K.
Most cited
By later US patents
- Conductor treating single-wafer type treating device and method for semi-conductor treating734US 7,235,137 B2Tokyo Electron Limited · 2007
- Rapid thermal processing apparatus for processing semiconductor wafers624US 5,444,217 AMoore Epitaxial, Inc. · 1995
- Semiconductor wafer boat with reduced wafer contact area607US 6,099,302 ASamsung Electronics Co., Ltd. · 2000
- Susceptor for a device for epitaxially growing objects and such a device566US 5,695,567 AABB Research Ltd. · 1997
- Heat treatment apparatus551US 5,718,574 ATokyo Electron Limited · 1998