C25D 7/123
Semiconductors first coated with a seed layer or a conductive layer
Official title: {Semiconductors first coated with a seed layer or a conductive layer}
C25D7/123 (Semiconductors first coated with a seed layer or a conductive layer) appears on 1,394 US grants and 1,772 published applications in this corpus.
Search patents in C25D- Granted patents
- 1,394
- Published applications
- 1,772
- Assignees
- 404
- Inventors
- 2,603
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 7 | 0 |
| 1999 | 14 | 0 |
| 2000 | 31 | 0 |
| 2001 | 62 | 27 |
| 2002 | 59 | 86 |
| 2003 | 66 | 94 |
| 2004 | 66 | 127 |
| 2005 | 54 | 107 |
| 2006 | 45 | 85 |
| 2007 | 55 | 54 |
| 2008 | 34 | 55 |
| 2009 | 26 | 51 |
| 2010 | 49 | 58 |
| 2011 | 42 | 48 |
| 2012 | 33 | 64 |
| 2013 | 41 | 56 |
| 2014 | 36 | 66 |
| 2015 | 31 | 87 |
| 2016 | 66 | 93 |
| 2017 | 75 | 86 |
| 2018 | 65 | 65 |
| 2019 | 82 | 85 |
| 2020 | 65 | 67 |
| 2021 | 67 | 62 |
| 2022 | 39 | 60 |
| 2023 | 55 | 69 |
| 2024 | 43 | 51 |
| 2025 | 40 | 50 |
| 2026 | 21 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Jet stream type plating device1 Sep 2026US 12,723,321 B2ASKA CORPORATION Co., Ltd.
- Methods of patterning a photoresist, and related patterning systems25 Aug 2026US 12,717,239 B2Liteq B.V.
- Method for manufacturing wiring board, and wiring board9 Jun 2026US 12,652,762 B2
- Integrated atmospheric plasma treatment station in processing tool2 Jun 2026US 12,648,418 B2Lam Research Corporation
- Composition for copper bump electrodeposition comprising a leveling agent21 Apr 2026US 12,606,925 B2BASF SE
- Method of semiconductor manufacturing, corresponding semiconductor product and device1 Oct 2026US 2026/0305373 A1STMicroelectronics International N. V.
- Differential contrast plating for advanced packaging applications3 Sep 2026US 2026/0258571 A1Lam Research Corporation
- Processing apparatus and chip manufacturing method27 Aug 2026US 2026/0250874 A1Disco Corporation
- Magnetic assembly and manufacturing process27 Aug 2026US 2026/0253781 A1MetaPWR Electronics Co., Ltd.
- Methods for low temperature bonding using nanoparticles30 Jul 2026US 2026/0223715 A1Adeia Semiconductor Technologies LLC
Most cited
By later US patents
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Electro-chemical deposition cell for face-up processing of single semiconductor substrates343US 6,416,647 B1APPLIED Materials.Inc. · 2002
- Electro-chemical deposition system333US 6,258,220 B1APPLIED Materials.Inc. · 2001