C25D 7/12
Semiconductors
C25D7/12 (Semiconductors) appears on 1,669 US grants and 2,122 published applications in this corpus.
Search patents in C25D- Granted patents
- 1,669
- Published applications
- 2,122
- Assignees
- 493
- Inventors
- 3,115
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 6 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 8 | 0 |
| 1999 | 17 | 0 |
| 2000 | 40 | 0 |
| 2001 | 76 | 30 |
| 2002 | 66 | 102 |
| 2003 | 74 | 109 |
| 2004 | 80 | 141 |
| 2005 | 61 | 115 |
| 2006 | 51 | 94 |
| 2007 | 63 | 59 |
| 2008 | 36 | 58 |
| 2009 | 27 | 57 |
| 2010 | 52 | 63 |
| 2011 | 46 | 52 |
| 2012 | 37 | 71 |
| 2013 | 47 | 63 |
| 2014 | 41 | 79 |
| 2015 | 36 | 98 |
| 2016 | 73 | 108 |
| 2017 | 82 | 93 |
| 2018 | 74 | 74 |
| 2019 | 93 | 100 |
| 2020 | 76 | 82 |
| 2021 | 75 | 82 |
| 2022 | 55 | 86 |
| 2023 | 76 | 99 |
| 2024 | 68 | 88 |
| 2025 | 62 | 85 |
| 2026 | 35 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Module kit for a chemical and/or electrolytic surface treatment of a substrate22 Sep 2026US 12,742,252 B2Lam Research Salzburg GmbH
- Jet stream type plating device1 Sep 2026US 12,723,321 B2ASKA CORPORATION Co., Ltd.
- Methods of patterning a photoresist, and related patterning systems25 Aug 2026US 12,717,239 B2Liteq B.V.
- Electroplating systems and methods with increased metal ion concentrations11 Aug 2026US 12,703,926 B2APPLIED Materials.Inc.
- Pre-wet module14 Jul 2026US 12,685,063 B2Ebara Corporation
- Electrolyte for forming anodic oxide film, method of forming anodic oxide film, and anodic oxide film and member for semiconductor device manufactured thereby8 Oct 2026US 2026/0308796 A1Komico Ltd.
- Method of semiconductor manufacturing, corresponding semiconductor product and device1 Oct 2026US 2026/0305373 A1STMicroelectronics International N. V.
- Methods for making high-density interconnects in advanced semiconductor packaging1 Oct 2026US 2026/0305374 A1Purdue Research Foundation
- Electroplating apparatus17 Sep 2026US 2026/0275563 A1ACM Research (Shanghai) Inc.
- Method for filling cobalt into through vias of a semiconductor wafer10 Sep 2026US 2026/0271691 A1City University of Hong Kong
Most cited
By later US patents
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Electro-chemical deposition cell for face-up processing of single semiconductor substrates343US 6,416,647 B1APPLIED Materials.Inc. · 2002
- Electro-chemical deposition system333US 6,258,220 B1APPLIED Materials.Inc. · 2001