C25D 7/00
Electroplating characterised by the article coated
C25D7/00 (Electroplating characterised by the article coated) appears on 4,253 US grants and 5,330 published applications in this corpus.
Search patents in C25D- Granted patents
- 4,253
- Published applications
- 5,330
- Assignees
- 1,833
- Inventors
- 9,930
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 25 | 0 |
| 1977 | 20 | 0 |
| 1978 | 22 | 0 |
| 1979 | 22 | 0 |
| 1980 | 19 | 0 |
| 1981 | 17 | 0 |
| 1982 | 17 | 0 |
| 1983 | 26 | 0 |
| 1984 | 21 | 0 |
| 1985 | 25 | 0 |
| 1986 | 18 | 0 |
| 1987 | 28 | 0 |
| 1988 | 21 | 0 |
| 1989 | 20 | 0 |
| 1990 | 23 | 0 |
| 1991 | 11 | 0 |
| 1992 | 19 | 0 |
| 1993 | 15 | 0 |
| 1994 | 15 | 0 |
| 1995 | 20 | 0 |
| 1996 | 19 | 0 |
| 1997 | 27 | 0 |
| 1998 | 37 | 0 |
| 1999 | 51 | 0 |
| 2000 | 74 | 0 |
| 2001 | 123 | 39 |
| 2002 | 97 | 141 |
| 2003 | 111 | 156 |
| 2004 | 106 | 197 |
| 2005 | 91 | 161 |
| 2006 | 82 | 173 |
| 2007 | 96 | 122 |
| 2008 | 60 | 142 |
| 2009 | 50 | 151 |
| 2010 | 97 | 189 |
| 2011 | 82 | 137 |
| 2012 | 100 | 184 |
| 2013 | 112 | 197 |
| 2014 | 114 | 214 |
| 2015 | 108 | 304 |
| 2016 | 182 | 353 |
| 2017 | 215 | 284 |
| 2018 | 197 | 239 |
| 2019 | 270 | 272 |
| 2020 | 233 | 267 |
| 2021 | 215 | 256 |
| 2022 | 181 | 236 |
| 2023 | 205 | 304 |
| 2024 | 223 | 271 |
| 2025 | 187 | 209 |
| 2026 | 104 | 132 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- C25D 7/12Semiconductors1,669
- C25D 7/06Wires1,059
- C25D 7/04Tubes377
- C25D 7/10Bearings129
- C25D 7/001Magnets86
- C25D 7/005Jewels59
- C25D 7/006Nanoparticles40
- C25D 7/003Threaded pieces36
All 11 subgroupsShow fewer
Recent patents
- Manufacturing method for tinplate6 Oct 2026US 12,752,324 B2Institute of Research of Iron and Steel, Jiangsu Province/Sha-Steel, Co. Ltd (Cn)
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- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- System for securing component for an electrically-driven process29 Sep 2026US 12,747,513 B2Chromalloy Gas Turbine Corporation
- Module kit for a chemical and/or electrolytic surface treatment of a substrate22 Sep 2026US 12,742,252 B2Lam Research Salzburg GmbH
- Metal oxide or metal nitride-coated steel fasteners8 Oct 2026US 2026/0308795 A1GM Global Technology Operations LLC
- Electrolyte for forming anodic oxide film, method of forming anodic oxide film, and anodic oxide film and member for semiconductor device manufactured thereby8 Oct 2026US 2026/0308796 A1Komico Ltd.
- Electroplated carbon fiber having electroplated layer and method for producing thereof1 Oct 2026US 2026/0297787 A1Fuji Design Co., Ltd.
- Method of semiconductor manufacturing, corresponding semiconductor product and device1 Oct 2026US 2026/0305373 A1STMicroelectronics International N. V.
- Methods for making high-density interconnects in advanced semiconductor packaging1 Oct 2026US 2026/0305374 A1Purdue Research Foundation
Most cited
By later US patents
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Electro-chemical deposition cell for face-up processing of single semiconductor substrates343US 6,416,647 B1APPLIED Materials.Inc. · 2002
- Electro-chemical deposition system333US 6,258,220 B1APPLIED Materials.Inc. · 2001