Composition for copper bump electrodeposition comprising a leveling agent
AssigneeBASF SE
InventorsNadine Engelhardt, Alexander Fluegel, Marco Arnold, Charlotte Emnet
Life of this patent
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Abstract
Disclosed herein is a composition for copper bump electrodeposition including copper ions and at least one additive including a polyalkyleneimine backbone including N-hydrogen atoms, where (a) the polyalkyleneimine backbone has a mass average molecular weight Mw of from 900 g/mol to 100 000 g/mol, (b) the N-hydrogen atoms are each substituted by a C2 to C6 polyoxyalkylene group, and (c) the average number of oxyalkylene units in the polyoxyalkylene group is from more than 10 to less than 30 per N-hydrogen atoms in the polyalkyleneimine.
Claims18
A composition comprising copper ions and at least one additive comprising a polyalkyleneimine backbone comprising N-hydrogen atoms, wherein
- (a) the polyalkyleneimine backbone has a mass average molecular weight MW of from 900 g/mol to 100 000 g/mol,
- (b) the N-hydrogen atoms are each substituted by a polyoxyalkylene group comprising C2 to C6 oxyalkylene units,
- (c) the average number of oxyalkylene units in the polyoxyalkylene group is of from more than 10 to less than 30 per N-hydrogen atom in the polyalkyleneimine, and
- wherein the alkyleneimine is an ethyleneimine.
Dependencies are inferred from the claim text.