C25D 17/14
For pad-plating
Official title: for pad-plating
C25D17/14 (For pad-plating) appears on 111 US grants and 104 published applications in this corpus.
Search patents in C25D- Granted patents
- 111
- Published applications
- 104
- Assignees
- 59
- Inventors
- 254
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 6 |
| 2003 | 4 | 6 |
| 2004 | 3 | 5 |
| 2005 | 2 | 9 |
| 2006 | 3 | 3 |
| 2007 | 6 | 4 |
| 2008 | 5 | 3 |
| 2009 | 3 | 7 |
| 2010 | 3 | 3 |
| 2011 | 2 | 0 |
| 2012 | 2 | 1 |
| 2013 | 4 | 1 |
| 2014 | 0 | 4 |
| 2015 | 0 | 3 |
| 2016 | 5 | 11 |
| 2017 | 3 | 4 |
| 2018 | 7 | 2 |
| 2019 | 6 | 7 |
| 2020 | 5 | 4 |
| 2021 | 1 | 6 |
| 2022 | 4 | 5 |
| 2023 | 4 | 2 |
| 2024 | 5 | 1 |
| 2025 | 0 | 4 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Devices, systems, and methods for treatment of tubulars14 Apr 2026US 12,601,081 B1Oceanit Laboratories, Inc.
- Co-electroplating Sn—Bi alloy solder for 3D-IC low-temperature bonding20 Jan 2026US 12,529,159 B2Hong Kong Applied Science and Technology Research Institute Company Limited
- Electrochemical treatment system12 Nov 2024US 12,139,809 B2Corrdesa, LLC
- Film forming apparatus for forming metal film and film forming method for forming metal film22 Oct 2024US 12,123,103 B2Toyota Jidosha Kabushiki Kaisha
- Film forming apparatus for forming metal film and film forming method for forming metal film8 Oct 2024US 12,110,604 B2Toyota Jidosha Kabushiki Kaisha
- Method for treating packaging for radioactive material against corrosion17 Sep 2026US 2026/0275561 A1Orano Nuclear Packages and Services
- Portable electrolytic deposition system including hydrogels and methods of using same18 Jun 2026US 2026/0168130 A1Chemeon Surface Technology, LLC
- An electrochemical treatment system18 Sep 2025US 2025/0290222 A1Corrdesa, LLC
- Electrochemical Treatment Methods11 Sep 2025US 2025/0283243 A1Corrdesa, LLC
- Plating device and plating formation method10 Jul 2025US 2025/0223718 A1Hitachi, Ltd.
Most cited
By later US patents
- Method and apparatus for plating and polishing a semiconductor substrate132US 6,328,872 B1Nutool, Inc. · 2001
- Method and apparatus for depositing and controlling the texture of a thin film113US 6,409,904 B1Nutool, Inc. · 2002
- Pad designs and structures for a versatile materials processing apparatus109US 6,413,388 B1Nutool, Inc. · 2002
- Plating apparatus74US 6,632,335 B2Ebara Corporation · 2003
- Workpeice proximity plating apparatus63US 6,630,059 B1Nutool, Inc. · 2003