Plating apparatus

An electrolytic treatment apparatus for performing electrolytic treatment of a substrate, to be treated, by filling an electrolytic solution between the substrate, to be treated, having a contact with one of electrodes consisting of an anode and a cathode, and the other electrode facing the substrate to be treated, characterized in that:

• a high resistance structure, having an electrical conductivity lower than that of the electrolytic solution, is provided in at least part of the electrolytic solution;
• an outer periphery of said high resistance structure is held by a holding member;
• and
• a seal member is provided between said high resistance structure and said holding member for preventing the electrolytic solution from leaking therethrough and preventing an electric current from flowing.

An apparatus for performing electrolytic treatment on a conductive layer surface on a substrate by supplying an electrolytic solution on the surface, comprising:

• a substrate holding portion for holding the substrate with the conductive layer facing upward, wherein said substrate holding portion is vertically moveable between an upper position for performing electrolytic treatment and a lower position for loading and unloading the substrate to and from the substrate holding portion;
• a first electrode disposed above said substrate holding portion so as to be positioned above the conductive layer surface of the substrate on said substrate holding portion at said upper position;
• a high resistance structure disposed between said first electrode and said substrate holding portion so as to be positioned between said first electrode and the conductive layer surface of the substrate on said substrate holding portion at said upper position, wherein said high resistance structure has a lower electrical conductivity than that of the electrolytic solution;
• a second electrode for electrically contacting the conductive layer surface;
• an electrolytic solution inlet for supplying the electrolytic solution to fluidly connect said first electrode, said high resistance structure and the conductive layer surface;
• and
• an annular sealing member, wherein said annular sealing member is operable to contact the conductive layer surface of the substrate at a peripheral portion of the substrate to hold the electrolytic solution on the conductive layer surface.

An apparatus for performing electrolytic treatment on a conductive layer surface on a substrate by supplying an electrolytic solution on the surface, comprising:

• a substrate holding portion for holding the substrate with the conductive layer facing upward;
• a first electrode disposed above said substrate holding portion so as to be positioned above the conductive layer surface of the substrate on said substrate holding portion;
• a high resistance structure having a lower electrical conductivity than that of the electrolytic solution;
• a second electrode for electrically contacting the conductive layer surface;
• an electrolytic solution inlet for supplying the electrolytic solution to fluidly connect said first electrode, said high resistance structure and the conductive layer surface;
• an electrode head positionable at a first location for supporting said high resistance structure between said first electrode and said substrate holding portion so as to position said high resistance structure between said first electrode and the conductive layer surface of the substrate on said substrate holding portion;
• a tray at a second location for holding electrolytic solution and receiving said electrode head such that a lower surface of said high resistance structure can contact the electrolytic solution in said tray;
• and
• an electrode arm connected to said electrode head and a rotating shaft to move said electrode head in a horizontal plane between said first location and said second location.

An apparatus for performing electroplating treatment on a conductive layer surface on a substrate by supplying a plating liquid on the surface, comprising:

• a substrate holding portion for holding the substrate with the conductive layer facing upward, wherein said substrate holding portion is vertically moveable between an upper position for performing electroplating treatment and a lower position for loading and unloading the substrate to and from said substrate holding portion;
• an anode disposed above said substrate holding portion so as to be positioned above the conductive layer surface of the substrate on said substrate holding portion at said upper position;
• a material capable of being impregnated with the plating liquid disposed between said anode and said substrate holding portion so as to be positioned between said anode and the conductive layer surface of the substrate on said substrate holding portion at said upper position;
• a cathode for electrically contacting the conductive layer surface;
• a plating liquid inlet for supplying the plating liquid to fluidly connect said anode, said material and the conductive layer surface;
• and
• an annular sealing member, wherein said annular sealing member is operable to contact the conductive layer surface of the substrate at a peripheral portion of the substrate to hold the plating liquid on the conductive layer surface.

An apparatus for performing electrolytic treatment on a conductive layer surface on a substrate by supplying an electrolytic solution on the surface, comprising:

• a substrate holding portion for holding the substrate with the conductive layer facing upward;
• a first electrode disposed above said substrate holding portion so as to be positioned above the conductive layer surface of the substrate on said substrate holding portion;
• a high resistance structure disposed between said first electrode and said substrate holding portion so as to be positioned between said first electrode and the conductive layer surface of the substrate on said substrate holding portion, wherein said high resistance structure has a lower electrical conductivity than that of the electrolytic solution;
• a second electrode for electrically contacting the conductive layer surface;
• an electrolytic solution inlet for supplying the electrolytic solution to fluidly connect said first electrode, said high resistance structure and the conductive layer surface;
• and
• a member positioned so as to shield an area of said high resistance structure so that an electrical field of the conductive layer surface on the substrate to be treated is controlled.