C25D 17/008
Current shielding devices
Official title: {Current shielding devices}
C25D17/008 (Current shielding devices) appears on 318 US grants and 376 published applications in this corpus.
Search patents in C25D- Granted patents
- 318
- Published applications
- 376
- Assignees
- 150
- Inventors
- 684
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 7 | 0 |
| 2001 | 15 | 3 |
| 2002 | 5 | 7 |
| 2003 | 5 | 8 |
| 2004 | 7 | 12 |
| 2005 | 7 | 19 |
| 2006 | 1 | 16 |
| 2007 | 6 | 6 |
| 2008 | 8 | 11 |
| 2009 | 7 | 13 |
| 2010 | 4 | 6 |
| 2011 | 10 | 5 |
| 2012 | 16 | 18 |
| 2013 | 8 | 16 |
| 2014 | 10 | 26 |
| 2015 | 8 | 7 |
| 2016 | 11 | 20 |
| 2017 | 9 | 17 |
| 2018 | 17 | 18 |
| 2019 | 16 | 22 |
| 2020 | 17 | 15 |
| 2021 | 17 | 16 |
| 2022 | 14 | 21 |
| 2023 | 19 | 23 |
| 2024 | 12 | 25 |
| 2025 | 19 | 19 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrate7 Jul 2026US 12,674,246 B2Lam Research Corporation
- Shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate19 May 2026US 12,630,938 B2Lam Research Salzburg GmbH
- Plating method and plating apparatus19 May 2026US 12,630,939 B2Ebara Corporation
- Electrode and apparatus for electrolytically treating a workpiece, assembly for forming a cell of the apparatus and method and computer program13 Jan 2026US 12,522,942 B2Atotech Deutschland GmbH
- Coaxial cable utilizing plated carbon nanotube elements and method of manufacturing same11 Nov 2025US 12,469,616 B2Amphenol Cable and Interconnect Technologies, Inc.
- Plating method and plating apparatus27 Aug 2026US 2026/0250877 A1Ebara Corporation
- Distribution system for the simultaneous chemical and/or electrolytic surface treatment of at least two substrates16 Jul 2026US 2026/0201598 A1Lam Research Salzburg GmbH
- Plating apparatus and plating solution discharging method16 Jul 2026US 2026/0201600 A1Ebara Corporation
- Electroplating system with low angle membrane11 Jun 2026US 2026/0159982 A1Lam Research Corporation
- Plating apparatus and plating method4 Jun 2026US 2026/0157208 A1Ebara Corporation
Most cited
By later US patents
- Electroplating anode including membrane partition system and method of preventing passivation of same206US 6,126,798 AInternational Business Machines Corporation · 2000
- Electroplating system with shields for varying thickness profile of deposited layer169US 6,027,631 ANovellus Systems, Inc. · 2000
- Clamshell apparatus for electrochemically treating wafers141US 6,800,187 B1Novellus Systems, Inc. · 2004
- Electroplating cell134US 4,696,729 AInternational Business Machines Corporation · 1987
- Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements113US 6,755,954 B2Novellus Systems, Inc. · 2004