Electroplating anode including membrane partition system and method of preventing passivation of same
AssigneesNovellus Systems, Inc., International Business Machines Corporation
InventorsJonathan David Reid, Robert J. Contolini, John Owen Dukovic
Life of this patent
Estimating the term…
Abstract
An anode includes an anode cup, a membrane and ion source material, the anode cup and membrane forming an enclosure in which the ion source material is located. The anode cup includes a base section having a central aperture and the membrane also has a central aperture. A jet is passed through the central apertures of the base section of the anode cup and through the membrane allowing plating solution to be directed at the center of a wafer being electroplated.
Claims38
An anode comprising:
- an anode cup;
- a membrane;
- and
- an ion source material, said anode cup and membrane forming an enclosure in which said ion source material is located.
A method of preventing anode passivation comprising the steps of:
- providing an anode comprising an anode cup, a membrane and ion source material, said ion source material being located in an enclosure formed by said anode cup and said membrane;
- and
- introducing plating solution into said enclosure and across said ion source material, wherein at least a first portion of said plating solution introduced into said enclosure exits said enclosure through said membrane.
An electroplating system comprising:
- a bath containing an electroplating solution;
- a power supply;
- a substrate immersed in said electroplating solution, a negative terminal of said power supply being electrically connected to said substrate;
- and
- an anode, a positive terminal of said power supply being electrically connected to said anode, said anode comprising:
- an anode cup;
- a membrane;
- and
- an ion source material, said anode cup and membrane forming an enclosure in which said ion source material is located.
Dependencies are inferred from the claim text.