C23G 1/103
Copper or alloys of copper
Official title: {copper or alloys of copper}
C23G1/103 (Copper or alloys of copper) appears on 133 US grants and 121 published applications in this corpus.
Search patents in C23G- Granted patents
- 133
- Published applications
- 121
- Assignees
- 103
- Inventors
- 342
- Latest grant
- 10 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 10 | 3 |
| 2002 | 7 | 6 |
| 2003 | 9 | 6 |
| 2004 | 2 | 12 |
| 2005 | 5 | 9 |
| 2006 | 5 | 7 |
| 2007 | 3 | 3 |
| 2008 | 1 | 10 |
| 2009 | 3 | 6 |
| 2010 | 2 | 7 |
| 2011 | 3 | 4 |
| 2012 | 5 | 1 |
| 2013 | 1 | 6 |
| 2014 | 4 | 3 |
| 2015 | 3 | 2 |
| 2016 | 3 | 5 |
| 2017 | 2 | 3 |
| 2018 | 2 | 1 |
| 2019 | 1 | 4 |
| 2020 | 3 | 5 |
| 2021 | 1 | 4 |
| 2022 | 6 | 2 |
| 2023 | 3 | 4 |
| 2024 | 4 | 3 |
| 2025 | 2 | 3 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for smoothing surface of copper foil and copper foil obtained10 Jun 2025US 12,325,929 B2Nan Ya Plastics Corporation
- Silver-plated product and method for producing same13 May 2025US 12,297,556 B2Dowa Metaltech Co., Ltd.
- Silver-plated product and method for producing same24 Dec 2024US 12,173,425 B2Dowa Metaltech Co., Ltd.
- Method for anti-corrosion treatment of metallic copper-containing materials14 May 2024US 11,982,002 B2Xiamen University
- Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer16 Apr 2024US 11,963,308 B2Atotech Deutschland GmbH
- Pulse magnetic field treatment method for eliminating residual stress in copper alloy foils20 Aug 2026US 2026/0242917 A1Taiyuan University of Technology
- Passivation coating on copper metal surface for copper wire bonding application26 Feb 2026US 2026/0054287 A1University of North Texas
- Silver-plated product and method for producing same17 Jul 2025US 2025/0230566 A1Dowa Metaltech Co., Ltd.
- Cleaning agent, cleaning method and supplementary liquid26 Jun 2025US 2025/0207069 A1Mec Company Ltd.
- Surface treatment agent, surface treatment method, and area-selective film forming method on substrate surface20 Feb 2025US 2025/0059389 A1Tokyo Ohka Kogyo.Co., Ltd.
Most cited
By later US patents
- Cleaning compositions for removing etching residue and method of using150US 5,334,332 AEKC Technology, Inc. · 1994
- Post clean treatment composition comprising an organic acid and hydroxylamine137US 5,981,454 AEKC Technology, Inc. · 1999
- Stripping compositions comprising hydroxylamine and alkanolamine89US 5,279,771 AEKC Technology, Inc. · 1994
- Post clean treatment85US 6,156,661 AEKC Technology, Inc. · 2000
- Method of removing etching residue59US 5,911,835 AEKC Technology, Inc. · 1999