Method for anti-corrosion treatment of metallic copper-containing materials

A method for anti-corrosion treatment of metallic copper-containing materials, comprising subjecting the metallic copper-containing materials and a stabilizer to a sealing and pressurizing reaction in the presence of a polar solvent and an additive,

• wherein the sealing and pressurizing reaction is conducted at a temperature of 120-180° C. for a time of 6-30 h,
• wherein the stabilizer is a compound capable of providing a formate, so that the formate is adsorbed on the surfaces of the metallic copper-containing materials, wherein the stabilizer is a formate salt, and wherein the formate salt is at least one selected from lithium formate, sodium formate, cesium formate, magnesium formate, aluminium triformate, potassium formate, ammonium formate, calcium formate, iron formate, strontium formate, barium formate, beryllium formate, nickel formate, cobalt formate, and manganese formate,
• wherein the additive is oleylamine,
• wherein the metallic copper-containing materials are copper nanowires, a diameter of the copper nanowires being 10-200 nm, the method for anti-corrosion treatment comprises the following steps:
• 1) Adding the copper nanowire into a dispersant, then adding the polar solvent and the oleylamine, the polar solvent being a polar organic solvent and/or water, and mixing to obtain a copper nanowire dispersion solution;
• wherein the dispersant is polyvinylpyrrolidone;
• 2) Adding the stabilizer into the copper nanowire dispersion solution obtained in the Step 1), and mixing to obtain a mixed solution;
• 3) Placing the mixed solution into a pressurized and heated sealing system for a sealing reaction;
• and
• 4) cooling the mixed solution obtained in the Step 3), then performing liquid-solid separation, and washing.