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US 12,325,929 B2Granted
Method for smoothing surface of copper foil and copper foil obtained
AssigneeNan Ya Plastics Corporation
InventorsTe-Chao Liao, Wei-Sheng Cheng, Chao-Tung Wu
Life of this patent
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Abstract
A method for smoothing surfaces of a copper foil and the copper foil obtained are provided, wherein the method for smoothing surfaces of the copper foil includes the following steps. Supplied with a copper foil. A first electropolishing process is performed on the copper foil. The copper foil is subjected to a pickling process. A second electropolishing process is performed on the copper foil.
Claims9
A method for smoothing a surface of a copper foil, comprising:
- providing the copper foil;
- performing a first electrolytic polishing process on the copper foil;
- performing a pickling process on the copper foil;
- and
- performing a second electrolytic polishing process on the copper foil,
- wherein the pickling process is performed after the first electrolytic polishing process and before the second electrolytic polishing process,
- wherein a polishing time of the second electrolytic polishing process is less than a polishing time of the first electrolytic polishing process, and the polishing time of the first electrolytic polishing process is less than or equal to 20 s.
4 more elements
Dependencies are inferred from the claim text.