C23C 18/1848
By electrochemical pretreatment
Official title: {by electrochemical pretreatment}
C23C18/1848 (By electrochemical pretreatment) appears on 19 US grants and 39 published applications in this corpus.
Search patents in C23C- Granted patents
- 19
- Published applications
- 39
- Assignees
- 28
- Inventors
- 75
- Latest grant
- 29 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 1 |
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 2 |
| 2008 | 0 | 2 |
| 2009 | 0 | 4 |
| 2010 | 0 | 3 |
| 2011 | 1 | 2 |
| 2012 | 1 | 1 |
| 2013 | 2 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 3 |
| 2016 | 0 | 5 |
| 2017 | 1 | 1 |
| 2018 | 1 | 0 |
| 2019 | 2 | 4 |
| 2020 | 0 | 0 |
| 2021 | 2 | 4 |
| 2022 | 2 | 3 |
| 2023 | 0 | 1 |
| 2024 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates29 Oct 2024US 12,129,551 B2Consolidated Nuclear Security, LLC
- Laminate9 Jul 2024US 12,031,213 B2Resonac Corporation
- Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates4 Oct 2022US 11,459,658 B2Consolidated Nuclear Security, LLC
- Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device20 Sep 2022US 11,447,871 B2Mitsubishi Electric Corporation
- Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates12 Oct 2021US 11,142,841 B2Consolidated Nuclear Security, LLC
- Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates19 Jan 2023US 2023/0017923 A1Consolidated Nuclear Security, LLC
- Laminate and method for producing same28 Jul 2022US 2022/0235468 A1Showa Denko K. K.
- Covers for electronic devices5 May 2022US 2022/0137680 A1Hewlett-Packard Development Company, L. P.
- Method for electroless nickel deposition onto copper without activation with palladium3 Mar 2022US 2022/0064801 A1Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates4 Nov 2021US 2021/0340688 A1Consolidated Nuclear Security, LLC
Most cited
By later US patents
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Chip interconnect and packaging deposition methods and structures105US 6,355,153 B1Nutool, Inc. · 2002
- Method for plating on titanium23US 4,938,850 AHughes Aircraft Company · 1990
- Packaging deposition methods5US 6,905,588 B2ASM Nutool, Inc. · 2005
- Pre-treatment for molybdenum or molybdenum-rich alloy articles to be plated3US 4,212,907 AThe United States of America as represented by the United States Department of Energy · 1980