Covers for electronic devices

An electronic device comprising:

• an electronic component;
• and
• a cover enclosing the electronic component, the cover comprising:
• a substrate having an opening therethrough, an outer edge, or both;
• a thermoplastic insert molding including metal oxide dopant, the thermoplastic insert molding positioned on the substrate;
• a paint coating on the thermoplastic insert molding;
• a chamfered edge on the substrate at a location that defines the opening, the outer edge, or both, wherein the chamfered edge cuts through the paint coating and partially through the thermoplastic insert molding to expose a portion of the metal oxide dopant at the chamfered edge;
• a metal layer formed using laser direct structuring masking a portion of the metal oxide dopant exposed at the chamfered edge;
• and
• a second metal layer formed over the metal layer.

A method of making a cover for an electronic device comprising:

• applying a thermoplastic insert molding that includes a metal oxide dopant over a substrate, the substrate including an opening therethrough, an outer edge, or both;
• applying a paint coating over the thermoplastic insert molding;
• chamfering an edge along the opening, the outer edge, or both to form a chamfered edge, wherein the chamfered edge cuts through the paint coating and partially through the thermoplastic insert molding to expose a portion of the metal oxide dopant at the chamfered edge;
• forming a metal layer on the chamfered edge using laser direct structuring to reduce the metal oxide material that is exposed at the chamfered edge;
• and
• forming a second metal layer over the metal layer.