C23C 18/1605
By masking
Official title: {by masking}
C23C18/1605 (By masking) appears on 304 US grants and 396 published applications in this corpus.
Search patents in C23C- Granted patents
- 304
- Published applications
- 396
- Assignees
- 240
- Inventors
- 941
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 7 | 0 |
| 2001 | 1 | 3 |
| 2002 | 6 | 5 |
| 2003 | 11 | 14 |
| 2004 | 9 | 24 |
| 2005 | 4 | 27 |
| 2006 | 10 | 20 |
| 2007 | 10 | 18 |
| 2008 | 5 | 18 |
| 2009 | 7 | 20 |
| 2010 | 10 | 15 |
| 2011 | 10 | 16 |
| 2012 | 6 | 15 |
| 2013 | 8 | 13 |
| 2014 | 10 | 19 |
| 2015 | 11 | 18 |
| 2016 | 13 | 35 |
| 2017 | 17 | 15 |
| 2018 | 15 | 24 |
| 2019 | 17 | 19 |
| 2020 | 14 | 19 |
| 2021 | 11 | 13 |
| 2022 | 12 | 6 |
| 2023 | 7 | 7 |
| 2024 | 5 | 7 |
| 2025 | 3 | 5 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transferable maskants suitable for chemical processing18 Aug 2026US 12,709,667 B2Quaker Chemical Corporation
- Radiation curable composition for plating applications23 Sep 2025US 12,421,405 B2Agfa-Gevaert
- Semiconductor package23 Sep 2025US 12,426,164 B2Resonac Corporation
- Multilayered nonpolar, chromium, copper material coatings of power electronics boards for thermal management24 Jun 2025US 12,342,449 B2The Board of Trustees of the University of Illinois
- Plating for thermal management20 Aug 2024US 12,068,221 B2Texas Instruments Incorporated
- Method of manufacturing nebuliser aperture plates25 Jun 2026US 2026/0176766 A1Stamford Devices Limited
- Semiconductor device and method of manufacturing semicondutor device25 Dec 2025US 2025/0391793 A1Fuji Electric Co., Ltd.
- Compound, polymer compound, photosensitive surface treatment agent, laminate, substrate for pattern formation, transistor, pattern formation method, and transistor manufacturing method18 Dec 2025US 2025/0386722 A1Nikon Corporation
- Method for manufacturing wiring substrate2 Oct 2025US 2025/0311111 A1Ibiden Co., Ltd.
- Method of Plating a Printed Circuit Board17 Jul 2025US 2025/0234462 A1Agfa-Gevaert
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Method of electroless plating copper on nitride barrier297US 6,436,816 B1Industrial Technology Research Institute · 2002
- Selective metallization process265US 5,510,216 AShipley Company, L.L.C. · 1996
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998
- Method of making contact tip structures184US 5,864,946 AForm Factor, Inc. · 1999