C09J 157/12
Containing nitrogen atoms
Official title: containing nitrogen atoms
C09J157/12 (Containing nitrogen atoms) appears on 6 US grants and 4 published applications in this corpus.
Search patents in C09J- Granted patents
- 6
- Published applications
- 4
- Assignees
- 5
- Inventors
- 15
- Latest grant
- 19 Apr 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 2 |
| 2019 | 0 | 2 |
| 2020 | 0 | 0 |
| 2021 | 1 | 0 |
| 2022 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the same19 Apr 2022US 11,306,225 B2Furukawa Electric Co., Ltd.
- Electrically conductive adhesive film and dicing-die bonding film using the same25 Jan 2022US 11,230,649 B2Furukawa Electric Co., Ltd.
- Electrically conductive adhesive film and dicing-die bonding film using the same7 Dec 2021US 11,193,047 B2Furukawa Electric Co., Ltd.
- Pressure sensitive adhesive compositions27 Jul 1999US 5,928,783 ANational Starch and Chemical Investment Holding Corporation
- High cohesive strength pressure-sensitive adhesives incorporating acetoacetate8 Nov 1994US 5,362,816 ARohm and Haas Company
- Articles of controllably bonded sheets and methods for making same20 Jun 2019US 2019/0184686 A1Corning Incorporated
- Electrically conductive adhesive film and dicing-die bonding film using the same17 Jan 2019US 2019/0016929 A1Furukawa Electric Co., Ltd.
- Electrically conductive adhesive film and dicing-die bonding film using the same6 Dec 2018US 2018/0346767 A1Furukawa Electric Co., Ltd.
- Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the same6 Dec 2018US 2018/0346768 A1Furukawa Electric Co., Ltd.
Most cited
By later US patents
- Pressure sensitive adhesive compositions28US 5,928,783 ANational Starch and Chemical Investment Holding Corporation · 1999
- High cohesive strength pressure-sensitive adhesives incorporating acetoacetate26US 5,362,816 ARohm and Haas Company · 1994
- Electrically conductive adhesive film and dicing-die bonding film using the same1US 11,230,649 B2Furukawa Electric Co., Ltd. · 2022
- Adhesive1US 4,303,760 ASony Corporation · 1981