Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the same

An electrically conductive adhesive agent composition comprising:

• a metal particle (Q);
• and
• an organophosphorus compound (A) represented by the general formula (1) below,
• wherein the metal particle (Q) comprises a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum and tin or an alloy comprising two or more metals selected from said group
• (RxPOR)y (1)
• in the general formula (1), each R independently represents an organic group, R may be the same or different with each other, x is an integer of 1 or 2, y is an integer of 1 or 2, and the sum (x+y) of x and y is 3, and each R independently comprises, in its moiety, one or more group selected from a maleic acid ester group, a maleic acid amide group, a maleic acid imide group, a primary amino group, a secondary amino group, a thiol group, a hydrosilyl group, a hydroboron group, and an epoxy group.