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US 2019/0016929 A1Published application
Electrically conductive adhesive film and dicing-die bonding film using the same
AssigneeFurukawa Electric Co., Ltd.
InventorsNaoaki Mihara, Noriyuki Kirikae, Jirou Sugiyama
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Abstract
The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 μm or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.
Claims12
An electrically conductive adhesive film comprising:
- a metal particle (Q);
- a resin (M);
- and
- an organophosphorus compound (A) represented by the general formula (1) below,
- wherein the resin (M) comprises a thermosetting resin (M1),
- the metal particle (Q) has an average particle size (d50) of 20 μm or less, and
- the metal particle (Q) comprises 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.
- in the general formula (1), each R independently represents an organic group, R may be the same or different with each other, both x and y are an integer from 0 to 3, and sum (x y) of x and y is 3.
5 more elements
Dependencies are inferred from the claim text.