Electrically conductive adhesive film and dicing-die bonding film using the same

An electrically conductive adhesive film comprising:

• a metal particle (Q);
• a resin (M);
• and
• at least one selected from the group consisting of an organic phosphine (A) represented by the general formula (1) below and a sulfide-based compound (B) represented by the general formula (2) below,
• PR)3 (1)
• SR)2 (2)
• in the general formulas (1) and (2), each R independently represents an organic group, and R may be the same or different with each other;
• wherein the electrically conductive adhesive film has a storage elastic modulus (G′) at 1 Hz measured in a state after sintering from 9000 to 20000 MPa and a thermal weight loss ratio when heated for 2 hours at 250° C. under a nitrogen atmosphere of less than 1%,
• wherein the metal particle (Q) comprises a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum and tin or an alloy comprising two or more metals selected from said group,
• wherein the metal particle (Q) is a mixture comprising the first metal particle (Q1) and a second metal particle (Q2) based on a metal component different from the first metal particle (Q1),
• wherein the first metal particle (Q1) and the second metal particle (Q2) comprise a metal component capable of mutually forming an intermetallic compound, and
• wherein an average particle size (D50) of the metal particle (Q) is equal to or less than 7 μm.