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US 2018/0346767 A1Published application
Electrically conductive adhesive film and dicing-die bonding film using the same
AssigneeFurukawa Electric Co., Ltd.
InventorsNaoaki Mihara, Noriyuki Kirikae, Jirou Sugiyama
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Abstract
The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250° C. under a nitrogen atmosphere of less than 1%.
Claims13
An electrically conductive adhesive film comprising:
- a metal particle (Q);
- a resin (M);
- and
- at least one of an organic phosphine (A) represented by the general formula (1) below and a sulfide-based compound (B) represented by the general formula (2) below,
- wherein the electrically conductive adhesive film has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250° C. under a nitrogen atmosphere of less than 1%
- PR)3 (1)
- SR)2 (2)
- in the general formulas (1) and (2), each R independently represents an organic group, and R may be the same or different with each other.
5 more elements
Dependencies are inferred from the claim text.