Electrically conductive adhesive film and dicing-die bonding film using the same

An electrically conductive adhesive film comprising:

• a metal particle (Q);
• a resin (M);
• and
• an organophosphorus compound (A) represented by the general formula (1) below,
• wherein the resin (M) comprises a thermosetting resin (M1),
• the metal particle (Q) has an average particle size (d50) of 20 μm or less, and
• the metal particle (Q) comprises 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state, wherein in the general formula (1)
• each R independently represents an organic group, R may be the same or different with each other, both x and y are an integer from 0 to 3, and sum (x+y) of x and y is 3, and each R independently includes, in its moiety, one or more groups selected from a maleic acid ester group, a maleic acid amide group, a maleic acid imide group, a primary amino group, a secondary amino group, a thiol group, a hydrosilyl group, a hydroboron group, and an epoxy group.