C08G 73/127
Containing oxygen in the form of ether bonds in the main chain
Official title: {containing oxygen in the form of ether bonds in the main chain}
C08G73/127 (Containing oxygen in the form of ether bonds in the main chain) appears on 91 US grants and 72 published applications in this corpus.
Search patents in C08G- Granted patents
- 91
- Published applications
- 72
- Assignees
- 54
- Inventors
- 234
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 8 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 0 | 0 |
| 2012 | 2 | 1 |
| 2013 | 0 | 1 |
| 2014 | 1 | 1 |
| 2015 | 2 | 0 |
| 2016 | 0 | 2 |
| 2017 | 1 | 0 |
| 2018 | 0 | 5 |
| 2019 | 2 | 2 |
| 2020 | 1 | 4 |
| 2021 | 2 | 4 |
| 2022 | 4 | 10 |
| 2023 | 4 | 10 |
| 2024 | 8 | 14 |
| 2025 | 4 | 5 |
| 2026 | 2 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Resin composition2 Sep 2025US 12,404,398 B2Nan Ya Plastics Corporation
- Resin composition and article made therefrom5 Aug 2025US 12,378,412 B2Elite Material Co., Ltd.
- Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package3 Jun 2025US 12,324,105 B2Resonac Corporation
- Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, semiconductor device, polyimide, manufacturing method for polyimide, and compound8 Oct 2026US 2026/0310076 A1FUJIFILM Corporation
- 3d printing of carbonaceous structures from water1 Oct 2026US 2026/0297263 A1
- Maleimide resin, resin composition, cured product, sheet, laminate, and printed wiring board1 Oct 2026US 2026/0297264 A1Resonac Corporation
- Polyimide resin precursor27 Aug 2026US 2026/0250462 A1Tokyo Ohka Kogyo.Co., Ltd.
- Polymer, negative photosensistive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic component11 Jun 2026US 2026/0161079 A1Shin-Etsu Chemical Co., Ltd.
Most cited
By later US patents
- Polyimides having bis-maleimide terminal groups45US 4,418,181 APlastics Engineering Company · 1983
- Bis-(maleamic acid) derivatives of triamines34US 4,438,280 APlastics Engineering Company · 1984
- Allyl or methallyl-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid imides and bisimides34US 4,515,962 ACiba-Geigy Corporation · 1985
- Curable cycloaliphatic epoxy-polyimide compositions31US 4,273,916 ATRW Inc. · 1981
- Cure retarding additives for acetylene-terminated polymers31US 4,381,363 AThe United States of America as represented by the Secretary of the Air Force · 1983