Polyimide resin precursor
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsKazuaki EBISAWA, Makiko IRIE
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AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsKazuaki EBISAWA, Makiko IRIE
Estimating the term…
A polyimide resin precursor that yields a polyimide resin having a low dielectric loss tangent and yields a photosensitive resin composition having exceptional photolithography properties, a photosensitive resin composition including the polyimide resin precursor as a polymerizable resin, a patterned resin film in which the photosensitive resin composition is used, and a method for producing a patterned polyimide resin film. The polyimide resin precursor has, in a side chain thereof, an unsaturated group having 3 or more and 30 or less carbon atoms that is free of (meth)acryloyl groups and has one or more ethylenically unsaturated double bonds, and optionally having, in a side chain, a (meth)acryloyl-group-containing group, wherein the number of mol of the unsaturated group and the number of mol of the (meth)acryloyl-group-containing group in the side chains are each within a prescribed range.
A polyimide resin precursor comprising a structural unit represented by a following formula (1):
Dependencies are inferred from the claim text.