C08G 73/126
The unsaturated precursors being wholly aromatic
Official title: {the unsaturated precursors being wholly aromatic}
C08G73/126 (The unsaturated precursors being wholly aromatic) appears on 150 US grants and 154 published applications in this corpus.
Search patents in C08G- Granted patents
- 150
- Published applications
- 154
- Assignees
- 99
- Inventors
- 482
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 6 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 12 | 0 |
| 1992 | 6 | 0 |
| 1993 | 6 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 1 | 2 |
| 2010 | 0 | 5 |
| 2011 | 1 | 1 |
| 2012 | 3 | 1 |
| 2013 | 0 | 3 |
| 2014 | 3 | 1 |
| 2015 | 3 | 0 |
| 2016 | 0 | 3 |
| 2017 | 1 | 2 |
| 2018 | 1 | 9 |
| 2019 | 5 | 6 |
| 2020 | 4 | 6 |
| 2021 | 7 | 18 |
| 2022 | 6 | 19 |
| 2023 | 8 | 23 |
| 2024 | 14 | 22 |
| 2025 | 13 | 18 |
| 2026 | 3 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Heat-curable bismaleimide resin composition15 Sep 2026US 12,735,535 B2Shin-Etsu Chemical Co., Ltd.
- Provisional fixation material and method for producing electronic component16 Jun 2026US 12,655,334 B2Sekisui Chemical Co., Ltd.
- Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board19 May 2026US 12,630,715 B2Panasonic Intellectual Property Management Co., Ltd.
- Curable photosensitive resin composition, cured product, resist pattern, method of producing resist pattern, semiconductor device and electronic device23 Dec 2025US 12,504,687 B2Arakawa Chemical Industries, Ltd.
- Poly(amide-imide) copolymer, composition and polymer film comprising thereof2 Sep 2025US 12,404,371 B2LG Chem.Ltd.
- Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, semiconductor device, polyimide, manufacturing method for polyimide, and compound8 Oct 2026US 2026/0310076 A1FUJIFILM Corporation
- 3d printing of carbonaceous structures from water1 Oct 2026US 2026/0297263 A1
- Maleimide resin, resin composition, cured product, sheet, laminate, and printed wiring board1 Oct 2026US 2026/0297264 A1Resonac Corporation
- Polyimide resin precursor27 Aug 2026US 2026/0250462 A1Tokyo Ohka Kogyo.Co., Ltd.
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package2 Jul 2026US 2026/0184866 A1Resonac Corporation
Most cited
By later US patents
- Polyimides having bis-maleimide terminal groups45US 4,418,181 APlastics Engineering Company · 1983
- Polyamino-bis-imide resin39US 4,526,838 AHitachi Chemical Company, Ltd. · 1985
- Bis-(maleamic acid) derivatives of triamines34US 4,438,280 APlastics Engineering Company · 1984
- Allyl or methallyl-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid imides and bisimides34US 4,515,962 ACiba-Geigy Corporation · 1985
- Curable cycloaliphatic epoxy-polyimide compositions31US 4,273,916 ATRW Inc. · 1981